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NSBC114TDXV6T1G PDF预览

NSBC114TDXV6T1G

更新时间： 2024-11-28 13:12:03
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安森美 - ONSEMI 晶体晶体管
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NSBC114TDXV6T1G 数据手册

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NSBC114EDXV6T1,  
NSBC114EDXV6T5  
Dual Bias Resistor  
Transistors  
NPN Silicon Surface Mount Transistors  
with Monolithic Bias Resistor Network  
http://onsemi.com  
(3)  
(2)  
(1)  
The BRT (Bias Resistor Transistor) contains a single transistor with  
a monolithic bias network consisting of two resistors; a series base  
resistor and a base−emitter resistor. These digital transistors are  
designed to replace a single device and its external resistor bias  
network. The BRT eliminates these individual components by  
integrating them into a single device. In the NSBC114EDXV6T1  
series, two BRT devices are housed in the SOT−563 package which is  
ideal for low power surface mount applications where board space is at  
a premium.  
R
R
1
2
Q
1
Q
2
R
2
R
1
(4)  
(5)  
(6)  
NSBC114EDXV6T1  
Features  
MARKING  
DIAGRAM  
• Simplifies Circuit Design  
• Reduces Board Space  
• Reduces Component Count  
• Lead−Free Solder Plating  
• These are Pb−Free Devices  
• NSV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and PPAP Capable  
SOT−563  
CASE 463A  
xx M G  
1
1
xx = Device Code (Refer to Page 2)  
M
G
= Date Code  
= Pb−Free Package  
MAXIMUM RATINGS  
(T = 25°C unless otherwise noted, common for Q and Q )  
A
ORDERING INFORMATION  
1
2
†
Device  
Package  
Shipping  
Rating  
Symbol  
Value  
Unit  
Vdc  
NSBC1xxxDXV6T1  
SOT−563 4000/Tape & Reel  
Collector-Base Voltage  
V
50  
50  
CBO  
CEO  
NSBC1xxxDXV6T1G SOT−563 4000/Tape & Reel  
NSVBC1xxxDXV6T1G SOT−563 4000/Tape & Reel  
Collector-Emitter Voltage  
Collector Current  
V
Vdc  
I
C
100  
mAdc  
THERMAL CHARACTERISTICS  
NSBC1xxxDXV6T5  
SOT−563 8000/Tape & Reel  
Characteristic  
(One Junction Heated)  
NSBC1xxxDXV6T5G SOT−563 8000/Tape & Reel  
Symbol  
Max  
Unit  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Total Device Dissipation; T = 25°C  
P
357 (Note 1)  
2.9 (Note 1)  
mW  
A
D
Derate above 25°C  
mW/°C  
Thermal Resistance, Junction-to-Ambient  
R
350 (Note 1)  
°C/W  
q
JA  
Characteristic  
(Both Junctions Heated)  
Symbol  
Max  
Unit  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking table  
on page 2 of this data sheet.  
Total Device Dissipation; T = 25°C  
P
D
500 (Note 1)  
4.0 (Note 1)  
mW  
mW/°C  
A
Derate above 25°C  
Thermal Resistance, Junction-to-Ambient  
R
250 (Note 1)  
°C/W  
°C  
q
JA  
Junction and Storage Temperature  
Range  
T , T  
J
−55 to +150  
stg  
1. FR−4 @ Minimum Pad  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
September, 2012 − Rev. 7  
NSBC114EDXV6/D  
 
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NSBC114TDXV6T1G 替代型号

型号 品牌 替代类型 描述 数据表
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