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NML04D33NTRF PDF预览

NML04D33NTRF

更新时间: 2024-09-13 03:46:15
品牌 Logo 应用领域
NIC 电感器
页数 文件大小 规格书
6页 420K
描述
Multilayer Chip Inductors

NML04D33NTRF 数据手册

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NML Series  
Multilayer Chip Inductors  
FEATURES  
• Designed for High Frequency Applications  
• Available in EIA 0402, 0603 and 0805Case Sizes  
• High Q and SRF Characteristics  
• Tight Tolerance D (0.3nH) and J ( 5%)  
Tape and Reel Packaging for Automatic Pick & Place  
RoHS  
Compliant  
includes all homogeneous materials  
*See Part Number System for Details  
SPECIFICATIONS  
NML Multilayer High Frequency Inductors  
Specifications  
Inductance Range  
Inductance Tolerance  
Operating Temperature Range  
0402  
0603  
0805  
1.0 ~ 120nH 1.5 ~ 220nH 1.5 ~ 470nH  
D(±0.3nH), J (±5%), K (±10%)  
-40°C ~ +85°C  
Q-Factor, Self Resonant Frequency,  
DC Resistance, Rated DC Current  
and Inductance Tolerance  
See Individual  
Product Listings  
ENVIRONMENTAL CHARACTERISTICS  
Test  
Specification  
Test Method & Condition  
Solderability  
75% Min. Coverage  
After 5 Sec. Dip in +230oC Solder Pot (Post Flux)  
After 500 Hrs at 60oC and 90-95% RH (No Load)  
After 10 Seconds at +260oC (3 Minute, 150oC Pre-Heat)  
Humidity Resistance  
Soldering Effect  
(1) No Evidence of Damage  
Low Frequency Vibration  
Thermal Shock  
(2) Inductance Shall Be Within ±10% of Initial Value  
(3) Q Factor Shall Be Within ± 20% of Initial Value  
After 100 Cycles (+85oC then -40°C) 1 hour each  
Low Temperature Storage  
(1) No Evidence of Damage  
(2) Inductance Shall Be Within + 10% of Initial Value  
(3) Q Factor Shall Be Within ±20% of Initial Value  
High Temperature Load Life  
Humidity Load Life  
After 500 Hrs at 85oC with Rated DC Current  
After 500 Hrs at 60oC with 90-95% RH with Rated DC Current  
PART NUMBER SYSTEM  
NML 04 J 22N TR F  
Pb-free/RoHS compliant  
Packaging: TR = Tape/Reel  
Inductance Code (N=decimal point) in nano-henries  
(Ex. 2N2 = 2.2nH, 33N=33nH, R10=100nH)  
Tolerance Code (D=±0.3nH, J=±5%, K=±10%)  
Size Code: 04=0402, 06=0603, 08=0805  
Series  
PART AND LAND PATTERN DIMENSIONS  
Series  
NML04  
NML06  
L
W
H
t
A
B
C
1.0 ± 0.05  
1.6 ± 0.10  
0.5 ± 0.05  
0.8 ± 0.10  
0.5 ± 0.05  
0.8 ± 0.15  
0.25 ± 0.1 0.50 ± 0.05 0.50 ± 0.05 0.50 ± 0.05  
0.30 ± 0.2 0.70 ± 0.10 0.70 ± 0.10 0.70 ± 0.10  
0.85 ± 0.20  
1.25 ± 0.20  
NML08  
2.0 ± 0.2  
1.25 ± 0.20  
0.50 ± 0.30 1.00 ± 0.10 1.00 ± 0.10 1.00 ± 0.10  
Solder  
Pads  
Body Composition:  
Al2O3 /B2O3 /SiO2  
Internal Coil: Ag  
C
Termination Material/Thickness:  
10µM Ni/Sn/Pb over 40µM Ag  
H
B
t
t
w
Component  
L
®
A
A
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com  
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Multilayer Chip Inductors