NML Series
Multilayer Chip Inductors
FEATURES
• Designed for High Frequency Applications
• Available in EIA 0402, 0603 and 0805Case Sizes
• High Q and SRF Characteristics
• Tight Tolerance D (0.3nH) and J ( 5%)
• Tape and Reel Packaging for Automatic Pick & Place
RoHS
Compliant
includes all homogeneous materials
*See Part Number System for Details
SPECIFICATIONS
NML Multilayer High Frequency Inductors
Specifications
Inductance Range
Inductance Tolerance
Operating Temperature Range
0402
0603
0805
1.0 ~ 120nH 1.5 ~ 220nH 1.5 ~ 470nH
D(±0.3nH), J (±5%), K (±10%)
-40°C ~ +85°C
Q-Factor, Self Resonant Frequency,
DC Resistance, Rated DC Current
and Inductance Tolerance
See Individual
Product Listings
ENVIRONMENTAL CHARACTERISTICS
Test
Specification
Test Method & Condition
Solderability
75% Min. Coverage
After 5 Sec. Dip in +230oC Solder Pot (Post Flux)
After 500 Hrs at 60oC and 90-95% RH (No Load)
After 10 Seconds at +260oC (3 Minute, 150oC Pre-Heat)
Humidity Resistance
Soldering Effect
(1) No Evidence of Damage
Low Frequency Vibration
Thermal Shock
(2) Inductance Shall Be Within ±10% of Initial Value
(3) Q Factor Shall Be Within ± 20% of Initial Value
After 100 Cycles (+85oC then -40°C) 1 hour each
Low Temperature Storage
(1) No Evidence of Damage
(2) Inductance Shall Be Within + 10% of Initial Value
(3) Q Factor Shall Be Within ±20% of Initial Value
High Temperature Load Life
Humidity Load Life
After 500 Hrs at 85oC with Rated DC Current
After 500 Hrs at 60oC with 90-95% RH with Rated DC Current
PART NUMBER SYSTEM
NML 04 J 22N TR F
Pb-free/RoHS compliant
Packaging: TR = Tape/Reel
Inductance Code (N=decimal point) in nano-henries
(Ex. 2N2 = 2.2nH, 33N=33nH, R10=100nH)
Tolerance Code (D=±0.3nH, J=±5%, K=±10%)
Size Code: 04=0402, 06=0603, 08=0805
Series
PART AND LAND PATTERN DIMENSIONS
Series
NML04
NML06
L
W
H
t
A
B
C
1.0 ± 0.05
1.6 ± 0.10
0.5 ± 0.05
0.8 ± 0.10
0.5 ± 0.05
0.8 ± 0.15
0.25 ± 0.1 0.50 ± 0.05 0.50 ± 0.05 0.50 ± 0.05
0.30 ± 0.2 0.70 ± 0.10 0.70 ± 0.10 0.70 ± 0.10
0.85 ± 0.20
1.25 ± 0.20
NML08
2.0 ± 0.2
1.25 ± 0.20
0.50 ± 0.30 1.00 ± 0.10 1.00 ± 0.10 1.00 ± 0.10
Solder
Pads
Body Composition:
Al2O3 /B2O3 /SiO2
Internal Coil: Ag
C
Termination Material/Thickness:
10µM Ni/Sn/Pb over 40µM Ag
H
B
t
t
w
Component
L
®
A
A
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
5