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NML04J1N8TRF

更新时间： 2024-11-06 09:10:07
品牌 Logo 应用领域
尼吉康 - NICHICON /
页数 文件大小 规格书
5页 64K
描述
General Purpose Inductor, 0.0018uH, 5%, 0402,

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NML04J1N8TRF 数据手册

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Multilayer Chip Inductors  
NML Series  
FEATURES  
• Designed for High Frequency Applications  
• Available in EIA 0201, 0402 and 0603 Case Sizes  
• High Q and SRF Characteristics  
RoHS  
Compliant  
includes all homogeneous materials  
• Tight Tolerance D (0.3nH) and J ( 5%)  
• Tape and Reel Packaging for Automatic Pick & Place  
*See Part Number System for Details  
SPECIFICATIONS  
NML Multilayer High Frequency Inductors  
Specifications  
0201  
0402  
0603  
Inductance Range  
0.3 ~ 56nH 1 ~ 220nH 1 ~ 330nH  
-40°C ~ +85°C  
Operating Temperature Range  
Q-Factor, Self Resonant Frequency,  
DC Resistance, Rated DC Current  
and Inductance Tolerance  
See Individual  
Product Listings  
ENVIRONMENTAL CHARACTERISTICS  
Test  
Specification  
Test Method & Condition  
Solderability  
Humidity Resistance  
Soldering Effect  
75% Min. Coverage  
After 5 Sec. Dip in +230°C Solder Pot (Post Flux)  
After 500 Hrs at +40°C and 90~95% RH (No Load)  
After 10 Sec. at +270°C (1 Minute, 150°C Pre-Heat)  
After 5 Cycles , +85°C to -40°C within 3 minutes  
After 500 hours at +85°C with Rated DC Current  
After 500 Hrs at +40°C with 90~95% RH at Rated DC Current  
(1) No Evidence of Damage  
(2) Inductance Shall Be Within ±10% of Initial Value  
(3) Q Factor Shall Be Within ±20% of Initial Value  
Thermal Shock  
High Temperature Load Life  
Humidity Load Life  
PART NUMBER SYSTEM  
NML 04 J 22N TR F  
RoHS compliant  
Packaging: TR = Tape/Reel  
Inductance Code (N=decimal point) in nano-henries  
(Ex. 2N2 = 2.2nH, 33N=33nH, R10=100nH)  
Tolerance Code (C=±0.2nH, D=±0.3nH, G=±2%, J=±5%, K=±10%)  
Size Code: 02=0201, 04=0402, 06=0603  
Series  
COMPONENT AND LAND PATTERN DIMENSIONS  
Series  
NML02  
NML04  
NML06  
L
W
H
t
A
B
C
0.6 ± 0.03  
1.0 ± 0.10  
1.6 ± 0.15  
0.3 ± 0.03  
0.5 ± 0.10  
0.8 ± 0.15  
0.33 max.  
0.5 ± 0.10  
0.8 ± 0.15  
0.1 ~ 0.2  
0.1 ~ 0.3  
0.2 ~ 0.6  
0.20 ~ 0.30 0.25 ~ 0.30 0.15 ~ 0.35  
0.35 ~ 0.45 0.40 ~ 0.50 0.30 ~ 0.50  
0.70 ~ 0.80 0.60 ~ 0.80 0.70 ~ 1.00  
Solder  
Pads  
Body Composition:  
Al2O3 /B2O3 /SiO2  
C
Termination Material:  
Sn over NI barrier over Ag base  
H
B
t
t
w
Component  
L
A
A
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com  
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