MC74HC259A
8-Bit Addressable Latch
1-of-8 Decoder
High−Performance Silicon−Gate CMOS
The MC74HC259A is identical in pinout to the LS259. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
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MARKING
The HC259A has four modes of operation as shown in the mode
selection table. In the addressable latch mode, the data on Data In is
written into the addressed latch. The addressed latch follows the data
input with all non−addressed latches remaining in their previous
states. In the memory mode, all latches remain in their previous state
and are unaffected by the Data or Address inputs. In the one−of−eight
decoding or demultiplexing mode, the addressed output follows the
state of Data In with all other outputs in the LOW state. In the Reset
mode all outputs are LOW and unaffected by the address and data
inputs. When operating the HC259A as an addressable latch, changing
more than one bit of the address could impose a transient wrong
address. Therefore, this should only be done while in the memory
mode.
DIAGRAMS
16
SOIC−16
D SUFFIX
CASE 751B
HC259AG
AWLYWW
16
1
1
16
TSSOP−16
DT SUFFIX
CASE 948F
HC
259A
ALYWG
G
16
1
1
A
= Assembly Location
= Wafer Lot
WL, L
YY, Y
= Year
Features
WW, W = Work Week
G or G
= Pb−Free Package
• Output Drive Capability: 10 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2 to 6 V
• Low Input Current: 1 mA
(Note: Microdot may be in either location)
PIN ASSIGNMENT
A0
A1
A2
Q0
Q1
Q2
1
2
3
4
5
6
7
8
16
V
CC
• High Noise Immunity Characteristic of CMOS Devices
15 RESET
14 ENABLE
13 DATA IN
12 Q7
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free and are RoHS Compliant
11 Q6
10 Q5
Q3
GND
9
Q4
MODE SELECTION TABLE
Enable Reset
Mode
L
H
L
H
H
L
Addressable Latch
Memory
8−Line Demultiplexer
Reset
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
June, 2012 − Rev. 3
MC74HC259A/D