MC74HC374A
Octal 3-State Non-Inverting
D Flip-Flop
High−Performance Silicon−Gate CMOS
The MC74HC374A is identical in pinout to the LS374. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
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Data meeting the setup time is clocked to the outputs with the rising
edge of the clock. The Output Enable input does not affect the states of
the flip−flops, but when Output Enable is high, the outputs are forced
to the high−impedance state; thus, data may be stored even when the
outputs are not enabled.
SOIC−20
DW SUFFIX
CASE 751D
TSSOP−20
DT SUFFIX
CASE 948E
The HC374A is identical in function to the HC574A which has the
input pins on the opposite side of the package from the output. This
device is similar in function to the HC534A which has inverting
outputs.
PIN ASSIGNMENT
OUTPUT
ENABLE
1
V
Q7
D7
D6
Q6
Q5
D5
D4
20
19
18
17
16
15
14
13
12
11
CC
Q0
D0
D1
Q1
Q2
D2
D3
Q3
GND
2
3
4
5
6
Features
• Output Drive Capability: 15 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2.0 to 6.0 V
• Low Input Current: 1.0 mA
7
8
9
10
Q4
CLOCK
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard
MARKING DIAGRAMS
No. 7 A
20
20
1
• Chip Complexity: 266 FETs or 66.5 Equivalent Gates
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
HC
74HC374A
AWLYYWWG
374A
ALYWG
G
1
• These Devices are Pb−Free and are RoHS Compliant
SOIC−20
TSSOP−20
A
WL, L
YY, Y
= Assembly Location
= Wafer Lot
= Year
LOGIC DIAGRAM
2
3
Q0
D0
WW, W = Work Week
5
6
4
G or G
= Pb−Free Package
Q1
Q2
Q3
Q4
Q5
Q6
Q7
D1
D2
D3
D4
D5
D6
D7
(Note: Microdot may be in either location)
7
8
9
FUNCTION TABLE
DATA
NONINVERTING
OUTPUTS
13
14
17
18
INPUTS
12
15
16
19
Inputs
Output
Output
Enable Clock
D
Q
L
L
L
H
L
X
X
H
L
No Change
Z
L,H,
X
11
CLOCK
H
X = don’t care
Z = high impedance
PIN 20 = V
CC
PIN 10 = GND
1
OUTPUT ENABLE
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
August, 2014 − Rev. 14
MC74HC374A/D