Datasheet > NLASB3157_06

NLASB3157_06

更新时间： 2024-09-16 03:46:23

品牌	Logo	应用领域
安森美 - ONSEMI		开关光电二极管
页数	文件大小	规格书
10页	98K
描述
SPDT, 3 ohm RON Switch

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NLASB3157_06 数据手册

NLASB3157

SPDT, 3 W R_ONSwitch

The NLASB3157 is an advanced CMOS analog switch fabricated

with silicon gate CMOS technology. It achieves very low

propagation delay and RDS resistances while maintaining CMOS

low power dissipation. Analog and digital voltages that may vary

across the full power−supply range (from V to GND). This device

is a drop in replacement for the NC7SB3157.

The select pin has overvoltage protection that allows voltages

http://onsemi.com

MARKING

above V

up to 7.0 V to be present on the pin without damage or

CC,

DIAGRAMS

disruption of operation of the part, regardless of the operating

voltage.

SC−88

AF MG

DF SUFFIX

CASE 419B

Features

• High Speed: t = 1.0 ns (Typ) at V = 5.0 V

• Low Power Dissipation: I = 2.0 mA (Max) at T = 25°C

WDFN6

MT SUFFIX

CASE 506AS

F M

• Standard CMOS Logic Levels

• High Bandwidth, Improved Linearity

• Switches Standard NTSC/PAL Video, Audio, SPDIF and HDTV

• May be used for Clock Switching, Data Multiplexing, etc.

• R Typical = 3 W @ V = 4.5 V

AF, F

= Specific Device Code

= Date Code*

= Pb−Free Package

(Note: Microdot may be in either location)

• Break Before Make Circuitry, Prevents Inadvertent Shorts

*Date Code orientation may vary depending

upon manufacturing location.

• 2 Devices can Switch Balanced Signal Pairs,

e.g. LVDS u 200−Mb/s

FUNCTION TABLE

• Latchup Performance Exceeds 300 mA

Select Input

Function

• Pin for Pin Drop in for NC7SB3157

• Tiny SC88 and WDFN6 Packages

B0 Connected to A

B1 Connected to A

• ESD Performance:

♦ Human Body Model; u 2000 V;

♦ Machine Model; u 200 V

ORDERING INFORMATION

• Extended Automotive Temperature Range −55°C to +125°C

(See Appendix)

†

Device

NLASB3157DFT2

Package

Shipping

• Pb−Free Packages are Available

SC−88

3000 Tape & Reel

NLASB3157DFT2G SC−88

(Pb−Free)

NLASB3157MTR2G WDFN6 3000 Tape & Reel

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Semiconductor Components Industries, LLC, 2006

Publication Order Number:

November, 2006 − Rev. 9

NLASB3157/D

12 3 4 5 6 7...10

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