NGB8206N
Ignition IGBT
20 A, 350 V, N−Channel D2PAK
This Logic Level Insulated Gate Bipolar Transistor (IGBT) features
monolithic circuitry integrating ESD and Overvoltage clamped
protection for use in inductive coil drivers applications. Primary uses
include Ignition, Direct Fuel Injection, or wherever high voltage and
high current switching is required.
http://onsemi.com
20 AMPS, 350 VOLTS
VCE(on) = 1.3 V @
IC = 10 A, VGE . 4.5 V
Features
• Ideal for Coil−on−Plug and Driver−on−Coil Applications
• Gate−Emitter ESD Protection
• Temperature Compensated Gate−Collector Voltage Clamp Limits
Stress Applied to Load
C
• Integrated ESD Diode Protection
• Low Threshold Voltage for Interfacing Power Loads to Logic or
Microprocessor Devices
R
G
G
• Low Saturation Voltage
R
GE
• High Pulsed Current Capability
• Optional Gate Resistor (R ) and Gate−Emitter Resistor (R
• Pb−Free Packages are Available
)
G
GE
E
MARKING DIAGRAM
Applications
4 Collector
• Ignition Systems
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
GB
8206NG
AYWW
J
1
Rating
Collector−Emitter Voltage
Collector−Gate Voltage
Gate−Emitter Voltage
Symbol
Value
390
Unit
V
2
D PAK
V
CES
CER
CASE 418B
STYLE 4
1
Gate
3
V
390
V
Emitter
2
V
$15
V
GE
Collector
Collector Current−Continuous
I
20
50
A
A
C
DC
AC
GB8206N = Device Code
@ T = 25°C − Pulsed
C
A
= Assembly Location
Continuous Gate Current
I
I
1.0
20
mA
mA
kV
G
G
Y
= Year
WW
G
= Work Week
= Pb−Free Package
Transient Gate Current (t ≤ 2 ms, f ≤ 100 Hz)
ESD (Charged−Device Model)
ESD
ESD
2.0
ESD (Human Body Model)
R = 1500 W, C = 100 pF
kV
ORDERING INFORMATION
8.0
†
50 Units / Rail
50 Units / Rail
Device
Package
Shipping
ESD (Machine Model) R = 0 W, C = 200 pF
ESD
500
V
2
NGB8206N
D PAK
Total Power Dissipation @ T = 25°C
P
150
1.0
W
W/°C
C
D
Derate above 25°C
2
NGB8206NG
D PAK
(Pb−Free)
Operating & Storage Temperature Range
T , T
−55 to
+175
°C
J
stg
2
NGB8206NT4
D PAK
800 / Tape & Reel
800 / Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
2
NGB8206NT4G
D PAK
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
August, 2006 − Rev. 6
NGB8206N/D