NGB8207AN, NGB8207ABN
Ignition IGBT
20 A, 365 V, N−Channel D2PAK
This Logic Level Insulated Gate Bipolar Transistor (IGBT) features
monolithic circuitry integrating ESD and Overvoltage clamped
protection for use in inductive coil drivers applications. Primary uses
include Ignition, Direct Fuel Injection, or wherever high voltage and
high current switching is required.
http://onsemi.com
20 AMPS, 365 VOLTS
Features
VCE(on) = 1.75 V
• Ideal for Coil−on−Plug and Driver−on−Coil Applications
Typ @ IC = 10 A, VGE . 4.5 V
• Gate−Emitter ESD Protection
• Temperature Compensated Gate−Collector Voltage Clamp Limits
Stress Applied to Load
C
• Integrated ESD Diode Protection
• Low Threshold Voltage for Interfacing Power Loads to Logic or
R
G
G
Microprocessor Devices
• Low Saturation Voltage
R
GE
• High Pulsed Current Capability
• Minimum Avalanche Energy − 500 mJ
E
• Gate Resistor (R ) = 70 W
G
• This is a Pb−Free Device
2
D PAK
CASE 418B
STYLE 4
Applications
• Ignition Systems
1
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
MARKING DIAGRAM
Rating
Collector−Emitter Voltage
Gate−Emitter Voltage
Symbol
Value
365
Unit
V
4
Collector
V
CES
V
GE
$15
V
NGB
8207AxG
AYWW
Collector Current−Continuous
I
20
50
A
A
C
DC
AC
@ T = 25°C − Pulsed
C
Continuous Gate Current
I
I
1.0
20
mA
mA
kV
G
1
Gate
3
Transient Gate Current (t ≤ 2 ms, f ≤ 100 Hz)
ESD (Charged−Device Model)
G
Emitter
2
ESD
ESD
2.0
Collector
ESD (Human Body Model)
R = 1500 W, C = 100 pF
kV
NGB8207Ax = Device Code
x = N or B
8.0
A
Y
WW
G
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ESD (Machine Model) R = 0 W, C = 200 pF
ESD
500
V
Total Power Dissipation @ T = 25°C
P
D
165
1.1
W
W/°C
C
Derate above 25°C (Note 1)
Operating & Storage Temperature Range
T , T
−55 to
+175
°C
J
stg
ORDERING INFORMATION
†
Device
Package
Shipping
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
2
NGB8207ANT4G
D PAK
800 / Tape & Reel
800 / Tape & Reel
(Pb−Free)
2
NGB8207ABNT4G
D PAK
1. Assuming infinite heatsink Case−to−Ambient
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
December, 2011 − Rev. 1
NGB8207AN/D