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NGB8207BNT4G

更新时间: 2024-11-22 01:16:55
品牌 Logo 应用领域
安森美 - ONSEMI 双极性晶体管
页数 文件大小 规格书
7页 132K
描述
Ignition IGBT 20 A, 365 V, N.Channel D2PAK

NGB8207BNT4G 数据手册

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NGB8207N, NGB8207BN  
Ignition IGBT  
20 A, 365 V, NChannel D2PAK  
This Logic Level Insulated Gate Bipolar Transistor (IGBT) features  
monolithic circuitry integrating ESD and Overvoltage clamped  
protection for use in inductive coil drivers applications. Primary uses  
include Ignition, Direct Fuel Injection, or wherever high voltage and  
high current switching is required.  
http://onsemi.com  
20 AMPS, 365 VOLTS  
CE(on) = 1.5 V Typ @  
Features  
V
Ideal for CoilonPlug and DriveronCoil Applications  
GateEmitter ESD Protection  
IC = 10 A, VGE . 4.5 V  
C
Temperature Compensated GateCollector Voltage Clamp Limits  
Stress Applied to Load  
Integrated ESD Diode Protection  
Low Threshold Voltage for Interfacing Power Loads to Logic or  
R
G
G
Microprocessor Devices  
Low Saturation Voltage  
R
GE  
High Pulsed Current Capability  
Minimum Avalanche Energy 500 mJ  
E
Gate Resistor (R ) = 70 W  
G
These are PbFree Devices  
2
D PAK  
CASE 418B  
STYLE 4  
Applications  
Ignition Systems  
1
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
MARKING DIAGRAM  
4
Rating  
CollectorEmitter Voltage  
GateEmitter Voltage  
Symbol  
Value  
365  
Unit  
V
Collector  
V
CES  
V
GE  
$15  
V
NGB  
8207xG  
AYWW  
Collector CurrentContinuous  
I
C
20  
50  
A
DC  
AC  
@ T = 25°C Pulsed  
A
C
Continuous Gate Current  
I
I
1.0  
20  
mA  
mA  
kV  
G
1
Gate  
3
Transient Gate Current (t 2 ms, f 100 Hz)  
ESD (ChargedDevice Model)  
G
Emitter  
2
Collector  
ESD  
ESD  
2.0  
NGB8207x = Device Code  
x = N or B  
ESD (Human Body Model)  
R = 1500 W, C = 100 pF  
kV  
8.0  
A
Y
= Assembly Location  
ESD (Machine Model) R = 0 W, C = 200 pF  
ESD  
500  
V
= Year  
WW  
G
= Work Week  
= PbFree Package  
Total Power Dissipation @ T = 25°C  
P
D
165  
1.1  
W
W/°C  
C
Derate above 25°C (Note 1)  
Operating & Storage Temperature Range  
T , T  
55 to  
°C  
ORDERING INFORMATION  
J
stg  
+175  
Device  
Package  
Shipping  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
2
NGB8207NT4G  
D PAK  
800 / Tape & Reel  
800 / Tape & Reel  
(PbFree)  
2
NGB8207BNT4G  
D PAK  
1. Assuming infinite heatsink CasetoAmbient  
(PbFree)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
December, 2011 Rev. 1  
NGB8207N/D  
 

NGB8207BNT4G 替代型号

型号 品牌 替代类型 描述 数据表
NGB8207NT4G ONSEMI

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