NGB8207N, NGB8207BN
Ignition IGBT
20 A, 365 V, N−Channel D2PAK
This Logic Level Insulated Gate Bipolar Transistor (IGBT) features
monolithic circuitry integrating ESD and Overvoltage clamped
protection for use in inductive coil drivers applications. Primary uses
include Ignition, Direct Fuel Injection, or wherever high voltage and
high current switching is required.
http://onsemi.com
20 AMPS, 365 VOLTS
CE(on) = 1.5 V Typ @
Features
V
• Ideal for Coil−on−Plug and Driver−on−Coil Applications
• Gate−Emitter ESD Protection
IC = 10 A, VGE . 4.5 V
C
• Temperature Compensated Gate−Collector Voltage Clamp Limits
Stress Applied to Load
• Integrated ESD Diode Protection
• Low Threshold Voltage for Interfacing Power Loads to Logic or
R
G
G
Microprocessor Devices
• Low Saturation Voltage
R
GE
• High Pulsed Current Capability
• Minimum Avalanche Energy − 500 mJ
E
• Gate Resistor (R ) = 70 W
G
• These are Pb−Free Devices
2
D PAK
CASE 418B
STYLE 4
Applications
• Ignition Systems
1
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
MARKING DIAGRAM
4
Rating
Collector−Emitter Voltage
Gate−Emitter Voltage
Symbol
Value
365
Unit
V
Collector
V
CES
V
GE
$15
V
NGB
8207xG
AYWW
Collector Current−Continuous
I
C
20
50
A
DC
AC
@ T = 25°C − Pulsed
A
C
Continuous Gate Current
I
I
1.0
20
mA
mA
kV
G
1
Gate
3
Transient Gate Current (t ≤ 2 ms, f ≤ 100 Hz)
ESD (Charged−Device Model)
G
Emitter
2
Collector
ESD
ESD
2.0
NGB8207x = Device Code
x = N or B
ESD (Human Body Model)
R = 1500 W, C = 100 pF
kV
8.0
A
Y
= Assembly Location
ESD (Machine Model) R = 0 W, C = 200 pF
ESD
500
V
= Year
WW
G
= Work Week
= Pb−Free Package
Total Power Dissipation @ T = 25°C
P
D
165
1.1
W
W/°C
C
Derate above 25°C (Note 1)
Operating & Storage Temperature Range
T , T
−55 to
°C
ORDERING INFORMATION
J
stg
+175
†
Device
Package
Shipping
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
2
NGB8207NT4G
D PAK
800 / Tape & Reel
800 / Tape & Reel
(Pb−Free)
2
NGB8207BNT4G
D PAK
1. Assuming infinite heatsink Case−to−Ambient
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
December, 2011 − Rev. 1
NGB8207N/D