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NE685 PDF预览

NE685

更新时间: 2024-11-15 03:46:43
品牌 Logo 应用领域
CEL 晶体晶体管
页数 文件大小 规格书
18页 355K
描述
SURFACE MOUNT NPN SILICON HIGH FREQUENCY TRANSISTOR

NE685 数据手册

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NE685  
NEC'S SURFACE MOUNT NPN  
SERIES  
SILICON HIGH FREQUENCY TRANSISTOR  
FEATURES  
• LOW COST  
• SMALL AND ULTRA SMALL SIZE PACKAGES  
• LOW VOLTAGE/LOW CURRENT OPERATION  
• HIGH GAIN BANDWIDTH PRODUCT: fT of 12 GHz  
• NOISE FIGURES OF 1.5 dB AT 2.0 GHZ  
19 (3 PIN ULTRA SUPER  
MINI MOLD)  
18 (SOT 343 STYLE)  
DESCRIPTION  
30 (SOT 323 STYLE)  
33 (SOT 23 STYLE)  
NEC's family of high frequency, low cost, surface mount  
devices are well suited for portable wireless communications  
and cellular radio applications.  
The NE685 series of high fT (12 GHz) devices is suitable for  
very low voltage/low current, low noise applications. These  
products are ideal for applications up to 2.4 GHz where low  
cost, high gain, low voltage, and low current are prime con-  
cerns.  
39 (SOT 143 STYLE)  
39R (SOT 143R STYLE)  
ELECTRICAL CHARACTERISTICS (TA = 25°C)  
PART NUMBER1  
EIAJ2 REGISTERED NUMBER  
PACKAGE OUTLINE  
NE68518  
2SC5015  
18  
NE68519  
2SC5010  
19  
NE68530  
2SC4959  
30  
NE68533  
2SC4955  
33  
NE68539/39R  
2SC4957  
39  
SYMBOLS PARAMETERS AND CONDITIONS UNITS MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX  
fT  
Gain Bandwidth Product at  
VCE = 3V, IC = 10 mA, f = 2.0 GHz  
GHz  
dB  
12  
12  
12  
12  
12  
NFMIN  
GNF  
Minimum Noise Figure at  
VCE = 3 V, IC = 3 mA, f = 2.0 GHz  
1.5 2.5  
8.5  
1.5 2.5  
1.5 2.5  
1.5 2.5  
1.5 2.5  
7.5  
Associated Gain at  
VCE = 3V, IC = 3 mA, f = 2.0 GHz  
dB  
7.5  
11  
9
7
7
10.5  
8
MAG  
Maximum Available Gain at  
VCE = 3 V, IC = 10 mA, f = 2.0 GHz  
dB  
12  
10  
8.5  
11  
2
|S21E|  
Insertion Power Gain at  
VCE = 3V, IC =10 mA, f = 2.0 GHz  
dB  
9
11  
7
7
7
9
10  
hFE  
ICBO  
IEBO  
Forward Current Gain3 at  
VCE = 3 V, IC = 10 mA  
75 110 150 75 110 150 75 110 150 75 110 150 75 110 150  
Collector Cutoff Current  
at VCB = 5 V, IE = 0 mA  
μA  
μA  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
Emitter Cutoff Current  
at VEB = 1 V, IC = 0 mA  
4
CRE  
Feedback Capacitance at  
VCB = 3 V, IE = 0 mA, f = 1 MHz  
pF  
0.3 0.5  
150  
0.4 0.7  
125  
0.4 0.7  
150  
0.4 0.7  
180  
0.3 0.5  
180  
PT  
Total Power Dissipation  
mW  
RTH(J-A)  
Thermal Resistance  
(Junction to Ambient)  
°C/W  
833  
200  
1000  
200  
833  
200  
620  
200  
620  
200  
RTH(J-C)  
Thermal Resistance(Junction to Case) °C/W  
Notes: 1. Precaution: Devices are ESD sensitive. Use proper handling procedures.  
2. Electronic Industrial Association of Japan.  
3. Pulsed measurement, PW350 μs, duty cycle 2%.  
4. The emitter terminal should be connected to the ground terminal  
of the 3 terminal capacitance bridge.  
California Eastern Laboratories  

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