生命周期: | Active | 零件包装代码: | BGA |
包装说明: | 13 X 15 MM, 1 MM PITCH, FBGA-165 | 针数: | 165 |
Reach Compliance Code: | unknown | 风险等级: | 5.75 |
最长访问时间: | 0.5 ns | 其他特性: | PIPELINED ARCHITECTURE |
JESD-30 代码: | R-PBGA-B165 | JESD-609代码: | e1 |
长度: | 15 mm | 内存密度: | 18874368 bit |
内存集成电路类型: | DDR SRAM | 内存宽度: | 18 |
功能数量: | 1 | 端子数量: | 165 |
字数: | 1048576 words | 字数代码: | 1000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 1MX18 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, THIN PROFILE |
并行/串行: | PARALLEL | 认证状态: | COMMERCIAL |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 1.9 V |
最小供电电压 (Vsup): | 1.7 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | TIN SILVER COPPER |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 宽度: | 13 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MT57W2MH8BF-3 | CYPRESS |
获取价格 |
DDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
MT57W2MH8BF-3.3 | CYPRESS |
获取价格 |
DDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
MT57W2MH8BF-4 | CYPRESS |
获取价格 |
DDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
MT57W2MH8BF-5 | CYPRESS |
获取价格 |
DDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
MT57W2MH8BF-7.5 | ROCHESTER |
获取价格 |
2MX8 DDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
MT57W2MH8CF-3 | CYPRESS |
获取价格 |
DDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
MT57W2MH8CF-3.3 | CYPRESS |
获取价格 |
DDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
MT57W2MH8CF-4 | CYPRESS |
获取价格 |
DDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
MT57W2MH8CF-4 | ROCHESTER |
获取价格 |
2MX8 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
MT57W2MH8CF-5 | CYPRESS |
获取价格 |
DDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 |