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ADVANCE
1 MEG x 16
ENHANCED BOOT BLOCK FLASH MEMORY
FLASH MEMORY
MT28F160A3
Low Voltage, Extended Temperature
FEATURES
• Thirty-nine erase blocks:
BALL ASSIGNMENT (Top View)
46-Ball FBGA
Two 4K-word boot blocks (protected)
Six 4K-word parameter blocks
Thirty-one 32K-word main memory blocks
• VCC, VCCQ and VPP voltages:
2.7V–3.3V VCC and VPP
1
2
3
4
5
6
7
8
2.7V–3.3V VCCQ*
5V VPP fast programming voltage
• Address access times:
90ns, 110ns at 2.7V–3.3V
• Low power consumption:
Standby and deep power-down mode < 1µA
(typical ICC)
Automatic power saving feature (APS mode)
• Enhanced WRITE/ERASE SUSPEND (1µs typical)
• Industry-standard command set compatibility
• Hardware block protection
A13
A11
A8
V
PP
WP#
A19
A7
A4
A
B
C
D
E
A14
A15
A16
A10
A12
WE#
A9
RP#
A18
A17
A6
A5
A3
A2
A1
A0
DQ14
DQ15
DQ7
DQ5
DQ6
DQ13
DQ2
DQ3
DQ8
DQ9
DQ10
CE#
DQ0
DQ1
DQ11
DQ12
DQ4
VCC
Q
VSS
VSS
VCC
OE#
F
OPTIONS
• Timing
NUMBER
(Ball Down)
90ns access
110ns access
-9
-11
NOTE: See page 3 for Ball Description Table.
• Boot Block Starting Address
Top (FFFFFH)
See last page for mechanical drawing.
T
B
Bottom (00000H)
• Package
accomplished by using high voltage which can be sup-
plied on a separate line.
46-ball FBGA (6 x 8 ball grid)
FD
• Temperature Range
The embedded WORD WRITE and BLOCK ERASE
functions are fully automated by an on-chip write state
machine (WSM), which simplifies these operations and
relieves the system processor of secondary tasks. The
WSM status can be monitored by an on-chip status
registertodeterminetheprogressofprogram/erasetasks.
Please refer to Micron’s Web site (www.micron.com/
flash) for the latest data sheet.
Commercial (0°C to +70°C)
Extended (-40°C to +85°C)
None
ET
*Lower VCCQ ranges are available upon request.
Part Number Example:
MT28F160A3FD-11 TET
GENERAL DESCRIPTION
DEVICE MARKING
The MT28F160A3 is a nonvolatile, electrically block-
erasable (flash), programmable, read-only memory con-
taining 16,777,216 bits organized as 1,048,576 words
(16 bits).
Due to the size of the package, Micron’s standard part
number is not printed on the top of each device. Instead,
an abbreviated device mark comprised of a five-digit
alphanumericcodeisused.Theabbreviateddevicemarks
are cross referenced to Micron part numbers in
Table 1.
TheMT28F160A3ismanufacturedon0.22µmprocess
technology in a 48-ball FBGA package. The device has an
I/O supply of 2.7V (MIN). Programming in production is
1 Meg x 16 Enhanced Boot Block Flash Memory
MT28F160A3_3.p65 – Rev. 3, Pub. 8/01
©2001, Micron Technology, Inc.
1
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PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PURPOSES ONLY AND
ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE. PRODUCTS ARE ONLY WARRANTED BY MICRON TO MEET
MICRON’S PRODUCTION DATA SHEET SPECIFICATIONS.