是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFP |
包装说明: | LFQFP, QFP64,.47SQ,20 | 针数: | 64 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.31.00.01 | 风险等级: | 1.07 |
Samacsys Confidence: | 3 | Samacsys Status: | Released |
Samacsys PartID: | 181520 | Samacsys Pin Count: | 64 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Quad Flat Packages |
Samacsys Footprint Name: | PM (S-PQFP-G64) | Samacsys Released Date: | 2015-04-13 16:55:37 |
Is Samacsys: | N | 具有ADC: | YES |
其他特性: | ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ | 地址总线宽度: | |
位大小: | 16 | 边界扫描: | YES |
CPU系列: | MSP430 | 最大时钟频率: | 16 MHz |
DAC 通道: | YES | DMA 通道: | YES |
外部数据总线宽度: | 格式: | FIXED POINT | |
集成缓存: | NO | JESD-30 代码: | S-PQFP-G64 |
JESD-609代码: | e4 | 长度: | 10 mm |
低功率模式: | YES | 湿度敏感等级: | 3 |
DMA 通道数量: | 3 | I/O 线路数量: | 48 |
串行 I/O 数: | 2 | 端子数量: | 64 |
计时器数量: | 10 | 片上程序ROM宽度: | 8 |
最高工作温度: | 105 °C | 最低工作温度: | -40 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFQFP | 封装等效代码: | QFP64,.47SQ,20 |
封装形状: | SQUARE | 封装形式: | FLATPACK, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 2/3.3 V |
认证状态: | Not Qualified | RAM(字节): | 4096 |
RAM(字数): | 4 | ROM(单词): | 94208 |
ROM可编程性: | FLASH | 座面最大高度: | 1.6 mm |
速度: | 16 MHz | 子类别: | Microcontrollers |
最大压摆率: | 0.595 mA | 最大供电电压: | 3.6 V |
最小供电电压: | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 10 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC | Base Number Matches: | 1 |
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