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MSP430F2616TZQW PDF预览

MSP430F2616TZQW

更新时间: 2024-11-21 05:50:27
品牌 Logo 应用领域
德州仪器 - TI 微控制器
页数 文件大小 规格书
102页 1700K
描述
MIXED SIGNAL MICROCONTROLLER

MSP430F2616TZQW 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:BGA
包装说明:VFBGA, BGA113,12X12,20针数:113
Reach Compliance Code:compliantHTS代码:8542.31.00.01
Factory Lead Time:1 week风险等级:5.28
具有ADC:YES其他特性:ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ
地址总线宽度:位大小:16
边界扫描:YESCPU系列:MSP430
最大时钟频率:16 MHzDAC 通道:YES
DMA 通道:YES外部数据总线宽度:
格式:FIXED POINT集成缓存:NO
JESD-30 代码:S-PBGA-B113JESD-609代码:e1
长度:7 mm低功率模式:YES
湿度敏感等级:3DMA 通道数量:3
I/O 线路数量:64串行 I/O 数:2
端子数量:113计时器数量:10
片上程序ROM宽度:8最高工作温度:105 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装等效代码:BGA113,12X12,20封装形状:SQUARE
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:2/3.3 V认证状态:Not Qualified
RAM(字节):4096RAM(字数):4
ROM(单词):94208ROM可编程性:FLASH
座面最大高度:1 mm速度:16 MHz
子类别:Microcontrollers最大压摆率:0.595 mA
最大供电电压:3.6 V最小供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.5 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

MSP430F2616TZQW 数据手册

 浏览型号MSP430F2616TZQW的Datasheet PDF文件第2页浏览型号MSP430F2616TZQW的Datasheet PDF文件第3页浏览型号MSP430F2616TZQW的Datasheet PDF文件第4页浏览型号MSP430F2616TZQW的Datasheet PDF文件第5页浏览型号MSP430F2616TZQW的Datasheet PDF文件第6页浏览型号MSP430F2616TZQW的Datasheet PDF文件第7页 
MSP430F241x, MSP430F261x  
MIXED SIGNAL MICROCONTROLLER  
SLAS541D -- JUNE 2007 -- REVISED NOVEMBER 2008  
D
D
Low Supply Voltage Range, 1.8 V to 3.6 V  
D
Supply Voltage Supervisor/Monitor With  
Programmable Level Detection  
Brownout Detector  
Bootstrap Loader  
Serial Onboard Programming,  
No External Programming Voltage Needed  
Programmable Code Protection by Security  
Fuse  
Ultra-Low Power Consumption:  
-- Active Mode: 365 µA at 1 MHz, 2.2 V  
-- Standby Mode (VLO): 0.5 µA  
-- Off Mode (RAM Retention): 0.1 µA  
Wake-Up From Standby Mode in Less  
Than 1 µs  
16-Bit RISC Architecture,  
62.5-ns Instruction Cycle Time  
Three-Channel Internal DMA  
12-Bit Analog-to-Digital (A/D) Converter  
With Internal Reference, Sample-and-Hold,  
and Autoscan Feature  
Dual 12-Bit Digital-to-Analog (D/A)  
Converters With Synchronization  
16-Bit Timer_A With Three  
Capture/Compare Registers  
16-Bit Timer_B With Seven  
Capture/Compare-With-Shadow Registers  
On-Chip Comparator  
Four Universal Serial Communication  
Interfaces (USCIs)  
D
D
D
D
D
D
Family MembersInclude:  
-- MSP430F2416  
D
D
92KB+256B Flash Memory, 4KB RAM  
-- MSP430F2417  
92KB+256B Flash Memory, 8KB RAM  
-- MSP430F2418  
D
D
D
116KB+256B Flash Memory, 8KB RAM  
-- MSP430F2419  
120KB+256B Flash Memory, 4KB RAM  
-- MSP430F2616  
92KB+256B Flash Memory, 4KB RAM  
-- MSP430F2617  
92KB+256B Flash Memory, 8KB RAM  
-- MSP430F2618  
D
D
116KB+256B Flash Memory, 8KB RAM  
-- MSP430F2619  
-- USCI_A0 and USCI_A1  
-- Enhanced UART Supporting  
Auto-Baudrate Detection  
-- IrDA Encoder and Decoder  
-- Synchronous SPI  
120KB+256B Flash Memory, 4KB RAM  
D
D
Available in 80-Pin Quad Flat Pack (QFP),  
64-Pin QFP, and 113-Pin Ball Grid Array  
(BGA) (See Available Options)  
For Complete Module Descriptions, See the  
MSP430x2xx Family User’s Guide,  
Literature Number SLAU144  
-- USCI_B0 and USCI_B1  
2
-- I Ct  
-- Synchronous SPI  
The MSP430F241x devices are identical to the MSP430F261x  
devices, with the exception that the DAC12 modules and the DMA  
controller are not implemented.  
description  
The Texas Instruments MSP430 family of ultralow-power microcontrollers consists of several devices featuring  
different sets of peripherals targeted for various applications. The architecture, combined with five low-power  
modes is optimized to achieve extended battery life in portable measurement applications. The device features  
a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code  
efficiency. The calibrated digitally controlled oscillator (DCO) allows wake-up from low-power modes to active  
mode in less than 1 µs.  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure toobserve properhandling andinstallation procedures can causedamage. ESDdamage canrange  
from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage  
because very small parametric changes could cause the device not to meet its published specifications. These devices have limited  
built-in ESD protection.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
I C is a registered trademark of Philips Incorporated.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
Copyright 2008, Texas Instruments Incorporated  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

MSP430F2616TZQW 替代型号

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