Datasheet > MSCMMX6DZCK08AB

MSCMMX6DZCK08AB

更新时间： 2024-09-21 01:15:43

品牌	Logo	应用领域
恩智浦 - NXP		PC
页数	文件大小	规格书
32页	1166K
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ARM Cortex-A9 MPCore 4xCPU processor

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MSCMMX6DZCK08AB 数据手册

Document Number: SCMIMX6DQIEC

Rev. 0, 01/2017

NXP Semiconductor, Inc.

Data Sheet: Technical Data

SCM-i.MX 6Dual/6Quad Datasheet

for Industrial Products

Contents

1. Introduction

1. Introduction ........................................................................1

1.1.

1.2.

1.3.

Ordering information...............................................2

Features ...................................................................3

References ...............................................................8

NXP Single Chip System Modules (SCMs) are a suite of

highly integrated products in an ultra-small form factor.

The first member of this portfolio, the NXP SCM-i.MX

6Dual/6Quad, drastically reduces time to market by

providing a solution that minimizes design time. We’ve

integrated and validated dual- and quad-core

performance, the power management system, flash

memory, and over a hundred passive system components

all in the size of a dime. The SCM-i.MX 6Dual/6Quad is

enabled with the standard i.MX 6Dual/6Quad

multimedia, connectivity and security features including

High Assurance Boot, cryptographic cipher engines,

random number generator, and tamper detection. It is a

scalable solution intended for use in a wide variety of

consumer and industrial applications.

2. Architectural Overview ......................................................9

2.1. Block Diagram ........................................................9

3. Modules List.....................................................................10

3.1. Special Signal Considerations ...............................10

4. Electrical Characteristics ..................................................11

4.1. Chip-Level Conditions ..........................................11

5. Power Supplies Requirements and Restrictions................12

5.1.

5.2.

5.3.

5.4.

5.5.

Power-Up Sequences.............................................12

Power-Down Sequences........................................12

Power Supplies Usage ...........................................12

Power Supplies Restrictions..................................12

Boot Configuration................................................12

6. Boot Mode Configuration.................................................14

6.1.

6.2.

Boot Mode Configuration Pins..............................14

Boot Devices Interfaces Allocation .......................14

7. Package Information.........................................................14

7.1.

7.2.

7.3.

7.4.

Signal List .............................................................14

Critical Signals ......................................................21

Ball Map................................................................24

Package Drawings .................................................26

The SCM-i.MX 6Dual/6Quad speeds and eases

development time by addressing technology challenges

such as design of DDR and power management. Our

single chip module i.MX 6Dual/6Quad consists of the

i.MX 6Dual/6Quad applications processor, PF0100

(PMIC) for power management, 16 MB SPI NOR, over

a hundred discrete components, and is enabled for

LPDDR2 via PoP assembly.

8. Revision History...............................................................30

NXP reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.

12 3 4 5 6 7...32

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