Datasheet > MQFP

MQFP

更新时间： 2024-09-19 03:48:31

品牌	Logo	应用领域
AMKOR		/
页数	文件大小	规格书
2页	390K
描述
Amkor’s MQFP IC package portfolio provides

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中文翻译

获取价格

数据手册

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MQFP 数据手册

LEADFRAME

data sheet

MQFP

Amkor’s MQFP IC package portfolio provides:

• 10 x 10 mm to 40 x 40 mm body size

• 44 to 304 lead counts

Features:

• Hi-conductivity copper leadframes

• Die up and down configurations

• JEDEC standard compliant

• Wide selection of leadframe die pad sizes

• Integrated thermal enhancement

• Heatspreader available

• Custom leadframe design available

• Fine pitch wire bond capability

• Lead free option available

Metric Quad Flat

Pack (MQFP)

Packages:

Amkor’s MQFP package portfolio enables

the designer, specifier or systems engineer

the flexibility of growing or shrinking IC

package size based upon application need.

Amkor employs the most up-to-date,

advanced equipment, material and

processes to assure successful, reliable

performance of your IC chips. Having a

complete line of MQFPs available and at

your disposal means security and conven-

ience. Sourcing them from Amkor means

success.

Thermal Resistance:

Multi-Layer PCB

Pkg Size (mm) Pad Size

38.4

33.7

200

32.1

27.9

^{Theta JA (°C/W) by Velocity}5^(L0^FP0^M)

Body

44 ld

64 ld

10 x 10

14 x 14

7.4 x 7.4

8.9 x 8.9

29.4

25.5

JEDEC Standard Test Boards

Multi-Layer PCB

Body

Pkg Size (mm) Pad Size

^The0^{ta JA (°C/W) by Velocity (LFPM)}

200

31.8

27.4

23.5

22.6

21.8

24.0

500

29.4

25.1

21.6

20.9

20.5

22.5

Thermal

Enhancement:

**44 ld

**64 ld

*100 ld

*208 ld

*240 ld

*304 ld

10 x 10

14 x 14

14 x 20

28 x 28

32 x 32

40 x 40

7.4 x 7.4

8.9 x 8.9

11.0 x 11.0

12.7 x 12.7

11.0 x 11.0

37.5

32.7

27.3

25.7

24.5

26.8

Some designs and applications require an

added margin of thermal performance

(power). Amkor’s easy and cost-effective

solution is a heatspreader. This optional

embedded thermal aid improves Theta JA

by greater than 15% (without external

heatsinks or fans) by increasing the heat

dissipation path from the IC chip to the

PCB.

* Pre-JEDEC Standard Test Boards

** JEDEC Standard Test Boards

Electrical:

Reliability:

Body Size

Inductance

(nH)

Capacitance

Resistance

(mΩ)

19.8

Pkg (mm) Lead

44 ld 10 x 10 Longest

(pF)

0.322

0.342

1.660

Applications:

Shortest 1.460

17.0

Amkor’s MQFP line is adapted to meet the

increasing challenges of advancing proces-

sors/controllers, DSP, ASIC, video-DAC, PC

chip-sets, gate arrays, logic, multi-media

and other technologies. These packages fill

many end application needs in consumer,

commercial, office, automotive, PC, indus-

trial and other product areas.

Simulated Results

@ 100 MHz

Amkor’s MQFPs are reliability assured through optimized design, material

and process enabling high performance operation of your IC chip.

• Moisture Sensitivity

Characterization

JEDEC Level 3

30 °C/60% RH, 192 hours

• PCT

121 °C /100% RH/2 atm., 504 hours

-65/+150 °C, 1000 cycles

85 °C/85% RH, 1000 hours

150 °C, 1000 hours

• Temp cycle

• Temp/Humidity

• High temp storage

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

TO VIEW THE MOST CURRENT PRODUCT INFORMATION

DS250G

Rev Date: 09’02

www.amkor.com

中文翻译

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与MQFP相关器件

型号	品牌	获取价格	描述	数据表
MQFP-D	STATSCHIP	获取价格	Heat Spreader Metric Quad Flat Pack
MQFP-ED	STATSCHIP	获取价格	Exposed Drop-in Heat Slug Metric Quad Flat Pack
MQFPPOWERQUAD2	AMKOR	获取价格	Exceptional thermal and electrical performance by design include the following
MQG101-2098	MURATA	获取价格	Voltage Controlled Oscillator, 2058MHz Min, 2138MHz Max
MQG101-2120	MURATA	获取价格	Voltage Controlled Oscillator, 2090MHz Min, 2150MHz Max
MQG101-2145	MURATA	获取价格	Voltage Controlled Oscillator, 2122MHz Min, 2167MHz Max
MQG101-2152	MURATA	获取价格	Voltage Controlled Oscillator, 2100MHz Min, 2204MHz Max
MQG101-2204	MURATA	获取价格	Voltage Controlled Oscillator, 2184MHz Min, 2224MHz Max
MQG101-2310	MURATA	获取价格	Voltage Controlled Oscillator, 2270MHz Min, 2350MHz Max
MQG101-2525	MURATA	获取价格	Voltage Controlled Oscillator, 2510MHz Min, 2540MHz Max

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