AMKOR TECHNOLOGY 更新时间:2023-01-05 15:42:10
Amkor 成立于 1968 年,不断的进步、发展和创新让我们成为超过 300 家全球领先半导体公司的战略及可靠的制造合作伙伴。我们的大容量专业制造技术和克服行业所面对技术挑战的能力是我们的最大优势。作为全球最大型的外包半导体先进封装设计、组装和测试服务的供应商之一,Amkor 帮助让创新技术变为现实。
型号 | 品牌 | 价格 | 文档 | 应用 | 描述 | |
CPGA | AMKOR | 获取价格 | ![]() |
Ceramic Pin Grid Array Package | ||
PPGA | AMKOR | 获取价格 | ![]() |
栅 | Plastic Pin Grid Array Package | |
POWERSOP2 | AMKOR | 获取价格 | ![]() |
Exceptional performance through the innovative design of PSOPs offer | ||
PLCC | AMKOR | 获取价格 | ![]() |
Amkor’s PLCC IC package portfolio provides | ||
LCC | AMKOR | 获取价格 | ![]() |
Leadless Chip Carrier Package | ||
ETCSP | AMKOR | 获取价格 | ![]() |
栅 | the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. | |
MCMPBGA | AMKOR | 获取价格 | ![]() |
Innovative designs and expanding package offerings provide a platform from prototype-to-pr | ||
LQFP | AMKOR | 获取价格 | ![]() |
Low Profile Quad Flat Pack (LQFP) Packages | ||
MQFP | AMKOR | 获取价格 | ![]() |
Amkor’s MQFP IC package portfolio provides | ||
PBGA | AMKOR | 获取价格 | ![]() |
Innovative designs and expanding package offerings provide a platform from prototype-to-pr | ||
PDIP | AMKOR | 获取价格 | ![]() |
光电二极管 | Amkor’s PDIP packages offer | |
PSVFBGA | AMKOR | 获取价格 | ![]() |
Package on Package (PoP) Family | ||
FLATPACK | AMKOR | 获取价格 | ![]() |
Ceramic Flat Pack Package | ||
FCCSP | AMKOR | 获取价格 | ![]() |
a flip chip solution in a CSP package format. | ||
CTBGA | AMKOR | 获取价格 | ![]() |
ChipArray㈢ Packages | ||
CSSOP | AMKOR | 获取价格 | ![]() |
Ceramic Shrink Small Outline Package | ||
CSPNL | AMKOR | 获取价格 | ![]() |
Wafer Level Packaging | ||
CSOIC | AMKOR | 获取价格 | ![]() |
Ceramic Small Outline Integrated Circuit Package | ||
CQFP | AMKOR | 获取价格 | ![]() |
Ceramic Quad Flat Pack Package | ||
CMCM | AMKOR | 获取价格 | ![]() |
Ceramic Multi-Chip Module Package | ||
CLGA | AMKOR | 获取价格 | ![]() |
栅 | Ceramic Land Grid Array Package | |
CERPAK | AMKOR | 获取价格 | ![]() |
Ceramic Pack | ||
CERDIP | AMKOR | 获取价格 | ![]() |
Ceramic Dual-Inline Package | ||
CDIP | AMKOR | 获取价格 | ![]() |
Ceramic Dual-Inline Package | ||
CBGA | AMKOR | 获取价格 | ![]() |
From innovative designs and expanding package offerings, Amkor provides a platform from pr | ||
CABGA | AMKOR | 获取价格 | ![]() |
ChipArray㈢ Packages | ||
LQFPPOWERQUAD4 | AMKOR | 获取价格 | ![]() |
LQFP PowerQuad㈢ 4 Packages | ||
MQFPPOWERQUAD2 | AMKOR | 获取价格 | ![]() |
Exceptional thermal and electrical performance by design include the following | ||
LQFPPOWERQUAD2 | AMKOR | 获取价格 | ![]() |
LQFP PowerQuad㈢ 2 Packages | ||
CVBGA | AMKOR | 获取价格 | ![]() |
ChipArray㈢ Packages |