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MPSA43RLRA PDF预览

MPSA43RLRA

更新时间: 2024-11-03 12:20:23
品牌 Logo 应用领域
安森美 - ONSEMI 晶体小信号双极晶体管
页数 文件大小 规格书
6页 107K
描述
High Voltage Transistors

MPSA43RLRA 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Obsolete零件包装代码:TO-92
包装说明:CASE 29-11, TO-226AA, 3 PIN针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.21.00.95风险等级:5.12
Is Samacsys:N最大集电极电流 (IC):0.05 A
集电极-发射极最大电压:200 V配置:SINGLE
最小直流电流增益 (hFE):40JEDEC-95代码:TO-92
JESD-30 代码:O-PBCY-T3JESD-609代码:e0
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:ROUND封装形式:CYLINDRICAL
峰值回流温度(摄氏度):240极性/信道类型:NPN
最大功率耗散 (Abs):0.625 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:NO
端子面层:Tin/Lead (Sn80Pb20)端子形式:THROUGH-HOLE
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
晶体管元件材料:SILICON标称过渡频率 (fT):50 MHz
Base Number Matches:1

MPSA43RLRA 数据手册

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MPSA42, MPSA43  
High Voltage Transistors  
NPN Silicon  
Features  
http://onsemi.com  
PbFree Packages are Available*  
COLLECTOR  
3
MAXIMUM RATINGS  
2
BASE  
Rating  
Symbol  
Value  
Unit  
CollectorEmitter Voltage  
V
CEO  
Vdc  
1
EMITTER  
MPSA43  
MPSA42  
200  
300  
CollectorBase Voltage  
EmitterBase Voltage  
V
Vdc  
CBO  
MPSA43  
MPSA42  
200  
300  
V
6.0  
Vdc  
EBO  
Collector Current Continuous  
I
500  
mAdc  
C
TO92  
(TO226AA)  
CASE 2911  
Total Device Dissipation  
P
D
D
1
2
3
BENT LEAD  
TAPE & REEL  
AMMO PACK  
1
@ T = 25°C  
625  
5.0  
mW  
mW/°C  
2
A
3
Derate above 25°C  
STRAIGHT LEAD  
BULK PACK  
Total Device Dissipation  
P
@ T = 25°C  
1.5  
12  
W
mW/°C  
C
Derate above 25°C  
MARKING DIAGRAM  
Operating and Storage Junction  
Temperature Range  
T , T  
55 to  
+150  
°C  
J
stg  
MPS  
A4x  
THERMAL CHARACTERISTICS  
Characteristic  
AYWWG  
Symbol  
Max  
Unit  
G
Thermal Resistance,  
R
q
JA  
200  
°C/mW  
JunctiontoAmbient  
Thermal Resistance,  
JunctiontoCase  
R
q
JC  
83.3  
°C/mW  
x
A
=
2 or 3  
= Assembly Location  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
Y
=
=
Year  
Work Week  
WW  
G
= PbFree Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 3 of this data sheet.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
September, 2010 Rev. 6  
MPSA42/D  

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