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MPN3700RLRP PDF预览

MPN3700RLRP

更新时间: 2024-09-20 13:01:51
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安森美 - ONSEMI 二极管开关测试高压
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MPN3700RLRP 数据手册

 浏览型号MPN3700RLRP的Datasheet PDF文件第2页浏览型号MPN3700RLRP的Datasheet PDF文件第3页浏览型号MPN3700RLRP的Datasheet PDF文件第4页 
MMBV3700LT1, MPN3700  
High Voltage Silicon Pin  
Diodes  
These devices are designed primarily for VHF band switching  
applications but are also suitable for use in general−purpose switching  
circuits. They are supplied in a cost−effective plastic package for  
economical, high−volume consumer and industrial requirements.  
They are also available in surface mount.  
http://onsemi.com  
SOT−23  
Features  
1
Anode  
3
Cathode  
Long Reverse Recovery Time t = 300 ns (Typ)  
Rugged PIN Structure Coupled with Wirebond Construction for  
Optimum Reliability  
rr  
MARKING  
DIAGRAM  
Low Series Resistance @ 100 MHz −  
R = 0.7 W (Typ) @ I = 10 mAdc  
S
F
SOT−23 (TO236AB)  
CASE 31808  
STYLE 8  
Reverse Breakdown Voltage = 200 V (Min)  
Pb−Free Packages are Available  
3
4R M G  
G
1
MAXIMUM RATINGS  
1
2
Rating  
Symbol  
Value  
Unit  
Reverse Voltage  
V
P
20  
Vdc  
4R = Specific Device Code  
R
D
M
= Date Code*  
Forward Power Dissipation  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
@ T = 25°C  
MMBV3700LT1  
200  
2.8  
mW  
mW/°C  
A
Derate above 25°C  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
Forward Power Dissipation  
P
D
@ T = 25°C  
MPN3700  
280  
2.8  
mW  
mW/°C  
A
Derate above 25°C  
TO−92  
Junction Temperature  
T
+125  
°C  
°C  
J
Storage Temperature Range  
T
stg  
−55 to +150  
1
Anode  
2
Cathode  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
MARKING  
DIAGRAM  
MPN  
3700  
AYWW G  
G
TO−92 (TO−226AC)  
CASE 182−06  
STYLE 1  
1
2
MPN  
= Device Code  
3700  
A
Y
= Specific Device  
= Assembly Location  
= Year  
WW  
G
= Work Week  
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
January, 2006 − Rev. 3  
MMBV3700LT1/D  

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