Datasheet > MPC8240RZU250

MPC8240RZU250

更新时间： 2024-09-17 19:50:23

品牌	Logo	应用领域
恩智浦 - NXP		外围集成电路
页数	文件大小	规格书
52页	1001K
描述
IC,MICROPROCESSOR,32-BIT,CMOS,BGA,352PIN,PLASTIC

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技术参数
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MPC8240RZU250 技术参数

生命周期：	Transferred	包装说明：	BGA, BGA352,26X26,50
Reach Compliance Code：	unknown	风险等级：	5.8
位大小：	32	JESD-30 代码：	S-PBGA-B352
端子数量：	352	封装主体材料：	PLASTIC/EPOXY
封装代码：	BGA	封装等效代码：	BGA352,26X26,50
封装形状：	SQUARE	封装形式：	GRID ARRAY
电源：	2.5/2.75,3.3 V	认证状态：	Not Qualified
速度：	250 MHz	子类别：	Microprocessors
表面贴装：	YES	技术：	CMOS
端子形式：	BALL	端子节距：	1.27 mm
端子位置：	BOTTOM	uPs/uCs/外围集成电路类型：	MICROPROCESSOR, RISC
Base Number Matches：	1

MPC8240RZU250 数据手册

Freescale Semiconductor, Inc.

Advance Information

MPC8240EC

Rev. 4, 11/2003

MPC8240

Integrated Processor

Hardware Specifications

The MPC8240 combines a MPC603e core microprocessor with a PCI bridge. The MPC8240

PCI support allows system designers to rapidly create systems using peripherals already

designed for PCI and the other standard interfaces. The MPC8240 also integrates a

high-performance memory controller that supports various types of DRAM and ROM. The

MPC8240 is the first of a family of products that provide system-level support for industry

standard interfaces with PowerPC™ microprocessor cores.

This hardware specification describes pertinent electrical and physical characteristics of the

MPC8240. For functional characteristics of the processor, refer to the MPC8240 Integrated

Processor User’s Manual (MPC8240UM).

This hardware specification contains the following topics:

Topic

Page

Section 1.1, “Overview”

Section 1.2, “Features”

Section 1.3, “General Parameters”

Section 1.4, “Electrical and Thermal Characteristics”

Section 1.5, “Package Description”

Section 1.6, “PLL Configurations”

Section 1.7, “System Design Information”

Section 1.8, “Document Revision History”

Section 1.9, “Ordering Information”

To locate any published errata or updates for this document, refer to the website at

http://www.motorola.com/semiconductors.

1.1 Overview

The MPC8240 integrated processor is comprised of a peripheral logic block and a 32-bit

superscalar MPC603e core, as shown in Figure 1.

For More Information On This Product,

Go to: www.freescale.com

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与MPC8240RZU250相关器件

型号	品牌	获取价格	描述	数据表
MPC8241	FREESCALE	获取价格	Intergrated Processor Hardware Specifications
MPC8241EC	FREESCALE	获取价格	MPC8241 Integrated Processor Hardware Specifications
MPC8241LVR166D	ROCHESTER	获取价格	32-BIT, 166MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 2.52 MM HEIGHT, 1.27 MM PITCH, LEAD F
MPC8241LVR200D	ROCHESTER	获取价格	32-BIT, 200MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 2.52 MM HEIGHT, 1.27 MM PITCH, LEAD F
MPC8241LVR200D	MOTOROLA	获取价格	32-BIT, 200MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM HEIGHT, LEAD FREE, PLASTIC, B
MPC8241LVR266D	MOTOROLA	获取价格	32-BIT, 266MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM HEIGHT, LEAD FREE, PLASTIC, B
MPC8241LZP200B	MOTOROLA	获取价格	RISC Microprocessor, 32-Bit, 200MHz, CMOS, PBGA357, 25 X 25 MM, 1.27 MM HEIGHT, PLASTIC, B
MPC8241LZQ166D	MOTOROLA	获取价格	32-BIT, 166MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM HEIGHT, PLASTIC, BGA-357
MPC8241LZQ200D	MOTOROLA	获取价格	32-BIT, 200 MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM HEIGHT, PLASTIC, BGA-357
MPC8241LZQ200D	ROCHESTER	获取价格	32-BIT, 200MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 2.52 MM HEIGHT, 1.27 MM PITCH, PLASTI

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