是否无铅: | 不含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | 25 X 25 MM, 2.52 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-357 | 针数: | 357 |
Reach Compliance Code: | unknown | 风险等级: | 5.78 |
地址总线宽度: | 32 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 66 MHz |
外部数据总线宽度: | 64 | 格式: | FLOATING POINT |
集成缓存: | YES | JESD-30 代码: | S-PBGA-B357 |
JESD-609代码: | e0 | 长度: | 25 mm |
低功率模式: | YES | 湿度敏感等级: | 3 |
端子数量: | 357 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | 260 |
认证状态: | COMMERCIAL | 座面最大高度: | 2.56 mm |
速度: | 200 MHz | 最大供电电压: | 1.9 V |
最小供电电压: | 1.7 V | 标称供电电压: | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
端子面层: | TIN LEAD | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 25 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MPC8241TZP166B | MOTOROLA |
获取价格 |
Microprocessor | |
MPC8241TZP166C | FREESCALE |
获取价格 |
Intergrated Processor Hardware Specifications | |
MPC8241TZP200B | MOTOROLA |
获取价格 |
Microprocessor | |
MPC8241TZP200C | FREESCALE |
获取价格 |
Intergrated Processor Hardware Specifications | |
MPC8241TZP266C | FREESCALE |
获取价格 |
Intergrated Processor Hardware Specifications | |
MPC8241TZQ166C | FREESCALE |
获取价格 |
Intergrated Processor Hardware Specifications | |
MPC8241TZQ166D | FREESCALE |
获取价格 |
Intergrated Processor Hardware Specifications | |
MPC8241TZQ166D | ROCHESTER |
获取价格 |
32-BIT, 166 MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 2.52 MM HEIGHT, 1.27 MM PITCH, PLAST | |
MPC8241TZQ200C | FREESCALE |
获取价格 |
Intergrated Processor Hardware Specifications | |
MPC8241TZQ266C | FREESCALE |
获取价格 |
Intergrated Processor Hardware Specifications |