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MPC8241TZP166C PDF预览

MPC8241TZP166C

更新时间: 2024-09-16 21:54:51
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Intergrated Processor Hardware Specifications

MPC8241TZP166C 数据手册

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Freescale Semiconductor, Inc.  
Advance Information  
MPC8241TXXPNS  
Rev. 1, 8/2003  
MPC8241 Part Number  
Specification for the  
XPC8241TXXnnnx Series  
Motorola Part  
Numbers Affected:  
This document describes part-number-specific changes to recommended operating conditions  
and revised electrical specifications, as applicable, from those described in the general  
MPC8241 Integrated Processor Hardware Specifications (Order No. MPC8241EC/D). The  
MPC8241 combines a MPC603e PowerPC™ core microprocessor with a PCI bridge.  
XPC8241TZP166B  
MPC8241TZQ166D  
XPC8241TZP200B  
MPC8241TZQ266D  
Specifications provided in this document supersede those in the MPC8241 Integrated  
Processor Hardware Specifications, Rev. 0.3 or later, for the part numbers listed in Table A  
only. Specifications not addressed herein are unchanged. Because this document is frequently  
updated, refer to http://www.motorola.com/semiconductors or to your Motorola sales office  
for the latest version.  
Note that headings and table numbers in this document are not consecutively numbered. They  
are intended to correspond to the heading or table affected in the general hardware  
specification.  
Part numbers addressed in this document are listed in Table A. For more detailed ordering  
information see Section 1.9, “Ordering Information.”  
Table A. Part Numbers Addressed by this Data Sheet  
Operating Conditions  
Significant  
Differences from  
Hardware  
Processor  
Version  
Register  
Value  
Motorola  
CPU  
Frequency  
(MHz)  
Part Number 1  
VDD  
TJ (°C)  
Specification  
XPC8241TZP166B  
MPC8241TZQ166D  
166  
200  
266  
1.8 ± 100 mV –40 to 105 Extended temperature 0x80811014  
range for additional part  
offering  
XPC8241TZP200B  
MPC8241TZQ166D  
MPC8241TZQ266D  
Note: The X prefix in a Motorola part number designates a “Pilot Production Prototype” as defined by  
Motorola SOP 3-13. These are from a limited production volume of prototypes manufactured, tested,  
and Q.A. inspected on a qualified technology to simulate normal production. These parts have only  
preliminary reliability and characterization data. Before pilot production prototypes may be shipped,  
written authorization from the customer must be on file in the applicable sales office acknowledging the  
qualification status and the fact that product changes may still occur while shipping pilot production  
prototypes.  
1
ZP = PGBA, ZQ = thick substrate and thick mold cap PBGA.  
For More Information On This Product,  
Go to: www.freescale.com  

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