MMDT3906
DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
A
•
•
•
•
•
Epitaxial Planar Die Construction
SOT-363
Ideal for Low Power Amplification and Switching
Ultra-Small Surface Mount Package
Lead Free/RoHS Compliant (Note 2)
"Green" Device (Note 3 and 4)
C2
B1
E1
Dim
A
B
C
D
F
Min
0.10
1.15
2.00
Max
0.30
1.35
2.20
C
B
E2
B2
C1
Mechanical Data
0.65 Nominal
H
•
•
Case: SOT-363
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Terminal Connections: See Diagram
Ordering and Date Code Information: See Page 4
Marking Information: K3N, See Page 4
Weight: 0.006 grams (approximate)
0.30
1.80
—
0.40
2.20
0.10
1.00
0.40
0.25
8°
K
J
H
J
M
•
•
•
K
L
0.90
0.25
0.10
0°
L
D
F
C2
B1
E1
M
α
•
•
•
•
All Dimensions in mm
E2
B2
C1
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Symbol
VCBO
VCEO
VEBO
IC
Value
-40
Unit
V
Collector-Emitter Voltage
-40
V
Emitter-Base Voltage
-5.0
-200
200
625
V
Collector Current - Continuous
mA
mW
Power Dissipation
(Note 1)
Pd
Thermal Resistance, Junction to Ambient
°C/W
°C
Rθ
JA
Operating and Storage Temperature Range
-55 to +150
Tj, TSTG
Notes:
1. Device mounted on FR-4 PCB; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
MMDT3906
© Diodes Incorporated
DS30124 Rev. 11 - 2
1 of 4
www.diodes.com