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MMDT3906_2 PDF预览

MMDT3906_2

更新时间: 2024-11-02 10:51:59
品牌 Logo 应用领域
美台 - DIODES 晶体晶体管
页数 文件大小 规格书
4页 169K
描述
DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

MMDT3906_2 数据手册

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MMDT3906  
DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR  
Features  
A
Epitaxial Planar Die Construction  
SOT-363  
Ideal for Low Power Amplification and Switching  
Ultra-Small Surface Mount Package  
Lead Free/RoHS Compliant (Note 2)  
"Green" Device (Note 3 and 4)  
C2  
B1  
E1  
Dim  
A
B
C
D
F
Min  
0.10  
1.15  
2.00  
Max  
0.30  
1.35  
2.20  
C
B
E2  
B2  
C1  
Mechanical Data  
0.65 Nominal  
H
Case: SOT-363  
Case Material: Molded Plastic. UL Flammability  
Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020C  
Terminals: Solderable per MIL-STD-202, Method 208  
Lead Free Plating (Matte Tin Finish annealed over Alloy 42  
leadframe).  
Terminal Connections: See Diagram  
Ordering and Date Code Information: See Page 4  
Marking Information: K3N, See Page 4  
Weight: 0.006 grams (approximate)  
0.30  
1.80  
0.40  
2.20  
0.10  
1.00  
0.40  
0.25  
8°  
K
J
H
J
M
K
L
0.90  
0.25  
0.10  
0°  
L
D
F
C2  
B1  
E1  
M
α
All Dimensions in mm  
E2  
B2  
C1  
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Collector-Base Voltage  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Value  
-40  
Unit  
V
Collector-Emitter Voltage  
-40  
V
Emitter-Base Voltage  
-5.0  
-200  
200  
625  
V
Collector Current - Continuous  
mA  
mW  
Power Dissipation  
(Note 1)  
Pd  
Thermal Resistance, Junction to Ambient  
°C/W  
°C  
Rθ  
JA  
Operating and Storage Temperature Range  
-55 to +150  
Tj, TSTG  
Notes:  
1. Device mounted on FR-4 PCB; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at  
http://www.diodes.com/datasheets/ap02001.pdf.  
2. No purposefully added lead.  
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.  
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date  
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.  
MMDT3906  
© Diodes Incorporated  
DS30124 Rev. 11 - 2  
1 of 4  
www.diodes.com  

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