Datasheet > MMDT3906_2

MMDT3906_2

更新时间： 2024-11-27 10:51:59

品牌	Logo	应用领域
美台 - DIODES		晶体晶体管
页数	文件大小	规格书
4页	169K
描述
DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

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中文翻译

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数据手册

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MMDT3906_2 数据手册

MMDT3906

DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

Features

•

Epitaxial Planar Die Construction

SOT-363

Ideal for Low Power Amplification and Switching

Ultra-Small Surface Mount Package

Lead Free/RoHS Compliant (Note 2)

"Green" Device (Note 3 and 4)

C₂

B₁

E₁

Dim

Min

0.10

1.15

2.00

Max

0.30

1.35

2.20

E₂

B₂

C₁

Mechanical Data

0.65 Nominal

•

Case: SOT-363

Case Material: Molded Plastic. UL Flammability

Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020C

Terminals: Solderable per MIL-STD-202, Method 208

Lead Free Plating (Matte Tin Finish annealed over Alloy 42

leadframe).

Terminal Connections: See Diagram

Ordering and Date Code Information: See Page 4

Marking Information: K3N, See Page 4

Weight: 0.006 grams (approximate)

0.30

1.80

—

0.40

2.20

0.10

1.00

0.40

0.25

8°

•

0.90

0.25

0.10

0°

C₂

B₁

E₁

•

All Dimensions in mm

E₂

B₂

C₁

Maximum Ratings @T_A= 25°C unless otherwise specified

Characteristic

Collector-Base Voltage

Symbol

V_CBO

V_CEO

V_EBO

I_C

Value

-40

Unit

Collector-Emitter Voltage

-40

Emitter-Base Voltage

-5.0

-200

200

625

Collector Current - Continuous

Power Dissipation

(Note 1)

P_d

Thermal Resistance, Junction to Ambient

°C/W

°C

R_θ

Operating and Storage Temperature Range

-55 to +150

T_j, T_STG

Notes:

1. Device mounted on FR-4 PCB; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at

http://www.diodes.com/datasheets/ap02001.pdf.

2. No purposefully added lead.

3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

MMDT3906

DS30124 Rev. 11 - 2

1 of 4

www.diodes.com

12 3 4

中文翻译

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