Datasheet > MMCP-67206E-15

MMCP-67206E-15

更新时间： 2024-11-30 05:48:07

品牌	Logo	应用领域
TEMIC		先进先出芯片
页数	文件大小	规格书
16页	105K
描述
FIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28

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MMCP-67206E-15 数据手册

M67206E

16 K ꢀ 9 High Speed CMOS Parallel FIFO Rad Tolerant

Introduction

The M67206E implements a first-in first-out algorithm, Using an array of eight transistors (8 T) memory cell, the

featuring asynchronous read/write operations. The FULL M67206E combine an extremely low standby supply

and EMPTY flags prevent data overflow and underflow. current (typ = 0.1 µA) with a fast access time at 15 ns

The Expansion logic allows unlimited expansion in word over the full temperature range. All versions offer battery

size and depth with no timing penalties. Twin address backup data retention capability with a typical power

pointers automatically generate internal read and write consumption at less than 2 µW.

addresses, and no external address information are

The M67206E is processed according to the methods of

required for the TEMIC FIFOs. Address pointers are

the latest revision of the MIL STD 883 (class B or S), ESA

automatically incremented with the write pin and read

SCC 9000 or QML.

pin. The 9 bits wide data are used in data communications

applications where a parity bit for error checking is

necessary. The Retransmit pin reset the Read pointer to

zero without affecting the write pointer. This is very

useful for retransmitting data when an error is detected in

the system.

Features

D First-in first-out dual port memory

D 16384 × 9 organisation

D Fully expandable by word width or depth

D Asynchronous read/write operations

D Empty, full and half flags in single device mode

D Retransmit capability

D Fast Flag and access times: 15, 30 ns

D Wide temperature range : – 55 °C to + 125 °C

D Bi-directional applications

D Battery back-up operation : 2 V data retention

D TTL compatible

D Single 5 V ± 10 % power supply

D High Performance SCMOS Technology

Rev. C – June 30, 1999

12 3 4 5 6 7...16

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与MMCP-67206E-15相关器件

型号	品牌	获取价格	描述	数据表
MMCP-67206E-15SB/SC	TEMIC	获取价格	FIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
MMCP-67206E-30	TEMIC	获取价格	FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
MMCP-67206E-30/883	TEMIC	获取价格	FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
MMCP-67206E-30SB/SC	TEMIC	获取价格	FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
MMCP-67206E-30SV	TEMIC	获取价格	FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
MMCP-67206EV-15	TEMIC	获取价格	FIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
MMCP-67206EV-15MQ	TEMIC	获取价格	FIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
MMCP-67206EV-30/883	TEMIC	获取价格	FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
MMCP-67206EV-30MQ	TEMIC	获取价格	FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
MMCP-67206EV-30SB/SC	TEMIC	获取价格	FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28

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