Datasheet > MMCP-67206FV-30

MMCP-67206FV-30

更新时间： 2024-11-30 04:43:47

品牌	Logo	应用领域
TEMIC		先进先出芯片
页数	文件大小	规格书
16页	89K
描述
FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28

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MMCP-67206FV-30 数据手册

M67206F

16 K ꢀ 9 High Speed CMOS Parallel FIFO Rad Tolerant

Introduction

The M67206F implements a first-in first-out algorithm, Using an array of eight transistors (8 T) memory cell, the

featuring asynchronous read/write operations. The FULL M67206F combine an extremely low standby supply

and EMPTY flags prevent data overflow and underflow. current (typ = 0.1 µA) with a fast access time at 15 ns

The Expansion logic allows unlimited expansion in word over the full temperature range. All versions offer battery

size and depth with no timing penalties. Twin address backup data retention capability with a typical power

pointers automatically generate internal read and write consumption at less than 2 µW.

addresses, and no external address information are

The M67206F is processed according to the methods of

required for the Atmel Wireless & Microcontrollers

the latest revision of the MIL STD 883 (class B or S), ESA

FIFOs. Address pointers are automatically incremented

SCC 9000 or QML.

with the write pin and read pin. The 9 bits wide data are

used in data communications applications where a parity

bit for error checking is necessary. The Retransmit pin

reset the Read pointer to zero without affecting the write

pointer. This is very useful for retransmitting data when

an error is detected in the system.

Features

D First-in first-out dual port memory

D 16384 × 9 organisation

D Fully expandable by word width or depth

D Asynchronous read/write operations

D Empty, full and half flags in single device mode

D Retransmit capability

D Fast Flag and access times: 15, 30 ns

D Wide temperature range : – 55 °C to + 125 °C

D Bi-directional applications

D Battery back-up operation : 2 V data retention

D TTL compatible

D Single 5 V ± 10 % power supply

D High Performance SCMOS Technology

Rev. D – June 5, 2000

12 3 4 5 6 7...16

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与MMCP-67206FV-30相关器件

型号	品牌	获取价格	描述	数据表
MMCP-67206FV-30/883	TEMIC	获取价格	FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28
MMCP-67206FV-30SB	MICROCHIP	获取价格	FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28
MMCP-67206FV-30SC	TEMIC	获取价格	FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28,
MMCP-67206HV-15	MICROCHIP	获取价格	FIFO, 16KX9, 15ns, Asynchronous, CDIP28
MMCP-67206HV-15-E	ATMEL	获取价格	Rad. Tolerant High Speed 16 Kb x 9 Parallel FIFO
MMCP-67206HV-30	MICROCHIP	获取价格	FIFO, 16KX9, 30ns, Asynchronous, CDIP28
MMCP-67206L-12	ETC	获取价格	x9 Asynchronous FIFO
MMCP-67206L-12/883	ETC	获取价格	x9 Asynchronous FIFO
MMCP-67206L-15	ETC	获取价格	x9 Asynchronous FIFO
MMCP-67206L-15/883	ETC	获取价格	x9 Asynchronous FIFO