是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | QFP | 包装说明: | LQFP, |
针数: | 100 | Reach Compliance Code: | unknown |
ECCN代码: | 3A991.B.2.A | HTS代码: | 8542.32.00.41 |
风险等级: | 5.22 | 最长访问时间: | 7.5 ns |
其他特性: | SELF TIMED WRITE CYCLE; BYTE WRITE CONTROL | 备用内存宽度: | 18 |
JESD-30 代码: | R-PQFP-G100 | JESD-609代码: | e0 |
长度: | 20 mm | 内存密度: | 4718592 bit |
内存集成电路类型: | CACHE SRAM | 内存宽度: | 9 |
功能数量: | 1 | 端口数量: | 1 |
端子数量: | 100 | 字数: | 524288 words |
字数代码: | 512000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 512KX9 | 输出特性: | 3-STATE |
可输出: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LQFP | 封装形状: | RECTANGULAR |
封装形式: | FLATPACK, LOW PROFILE | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
座面最大高度: | 1.6 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 3.135 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 14 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MCM69F819TQ8 | MOTOROLA |
获取价格 |
256K x 18 Bit Flow-Through BurstRAM Synchronous Fast Static RAM | |
MCM69F819TQ8 | NXP |
获取价格 |
IC,SYNC SRAM,256KX18,CMOS,QFP,100PIN,PLASTIC | |
MCM69F819TQ8.5 | MOTOROLA |
获取价格 |
256K x 18 Bit Flow-Through BurstRAM Synchronous Fast Static RAM | |
MCM69F819TQ8.5R | MOTOROLA |
获取价格 |
256K x 18 Bit Flow-Through BurstRAM Synchronous Fast Static RAM | |
MCM69F819TQ8.5R | NXP |
获取价格 |
256KX18 CACHE SRAM, 8.5ns, PQFP100, TQFP-100 | |
MCM69F819TQ8R | MOTOROLA |
获取价格 |
256K x 18 Bit Flow-Through BurstRAM Synchronous Fast Static RAM | |
MCM69F819TQ8R | NXP |
获取价格 |
IC,SYNC SRAM,256KX18,CMOS,QFP,100PIN,PLASTIC | |
MCM69F819ZP11 | MOTOROLA |
获取价格 |
256K x 18 Bit Flow-Through BurstRAM Synchronous Fast Static RAM | |
MCM69F819ZP11 | NXP |
获取价格 |
IC,SYNC SRAM,256KX18,CMOS,BGA,119PIN,PLASTIC | |
MCM69F819ZP11R | MOTOROLA |
获取价格 |
256K x 18 Bit Flow-Through BurstRAM Synchronous Fast Static RAM |