Freescale Semiconductor, Inc.
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MCM63F737K/D
MCM63F737K
MCM63F819K
Advance Information
128K x 36 and 256K x 18 Bit
Flow–Through BurstRAM
Synchronous Fast Static RAM
The MCM63F737K and MCM63F819K are 4M–bit synchronous fast static
RAMs designedtoprovideaburstable, highperformance, secondarycache. The
MCM63F737K (organized as 128K words by 36 bits) and the MCM63F819K
(organized as 256K words by 18 bits) integrate input registers, a 2–bit address
counter, and high speed SRAM onto a single monolithic circuit for reduced parts
count in cache data RAM applications. Synchronous design allows precise cycle
control with the use of an external clock (K).
TQ PACKAGE
TQFP
CASE 983A–01
Addresses (SA), data inputs (DQx), and all control signals except output
enable(G), sleepmode(ZZ), andlinearburstorder(LBO)areclock(K)controlled
through positive–edge–triggered noninverting registers.
ZP PACKAGE
PBGA
Bursts can be initiated with either ADSP or ADSC input pins. Subsequent burst
addresses can be generated internally by the MCM63F737K and MCM63F819K
(burstsequenceoperatesinlinearorinterleavedmodedependentuponthestate
of LBO) and controlled by the burst address advance (ADV) input pin.
Write cycles are internally self–timed and are initiated by the rising edge of the
clock (K) input. This feature eliminates complex off–chip write pulse generation
and provides increased timing flexibility for incoming signals.
CASE 999–02
Synchronous byte write (SBx), synchronous global write (SGW), and
synchronous write enable (SW) are provided to allow writes to either individual
bytes or to all bytes. The bytes are designated as “a”, “b”, etc. SBa controls DQa,
SBb controls DQb, etc. Individual bytes are written if the selected byte writes SBx
are asserted with SW. All bytes are written if either SGW is asserted or if all SBx
and SW are asserted.
For read cycles, a flow–through SRAM allows output data to simply flow freely
from the memory array.
TheMCM63F737KandMCM63F819Koperatefroma3.3Vcorepowersupply
and all outputs operate on a 2.5 V or 3.3 V power supply. All inputs and outputs
are JEDEC standard JESD8–5 compatible.
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MCM63F737K/MCM63F819K–8.5 = 8.5 ns Access
MCM63F737K/MCM63F819K–9 ns = 9 ns Access
MCM63F737K/MCM63F819K–11 ns = 11 ns Access
3.3 V +10%, –5% Core Power Supply, 2.5 V or 3.3 V I/O Supply
ADSP, ADSC, and ADV Burst Control Pins
Selectable Burst Sequencing Order (Linear/Interleaved)
Single–Cycle Deselect Timing
Internally Self–Timed Write Cycle
Byte Write and Global Write Control
Sleep Mode (ZZ)
JEDEC Standard 100–Pin TQFP and 119–Pin PBGA Packages
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This document contains information on a new product. Specifications and information herein are subject to change without notice.
10/1/99
Motorola, Inc. 1999
MOTOROLA FAST SRAM
MCM63F737K•MCM63F819K
For More Information On This Product,
Go to: www.freescale.com
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