MC74VHC245
Octal Bus Buffer/Line Driver
The MC74VHC245 is an advanced high speed CMOS octal bus
transceiver fabricated with silicon gate CMOS technology. It achieves
high speed operation similar to equivalent Bipolar Schottky TTL
while maintaining CMOS low power dissipation.
It is intended for two−way asynchronous communication between
data buses. The direction of data transmission is determined by the
level of the DIR input. The output enable pin (OE) can be used to
disable the device, so that the buses are effectively isolated.
All inputs are equipped with protection circuits against static
discharge.
http://onsemi.com
MARKING
DIAGRAMS
20
20
• High Speed: t = 4.0 ns (Typ) at V = 5 V
PD
CC
VHC245
1
• Low Power Dissipation: I = 4 μA (Max) at T = 25°C
CC
A
AWLYYWWG
SOIC−20
• High Noise Immunity: V
= V = 28% V
NIL CC
NIH
DW SUFFIX
CASE 751D
• Power Down Protection Provided on Inputs
• Balanced Propagation Delays
1
• Designed for 2 V to 5.5 V Operating Range
20
• Low Noise: V
= 1.2 V (Max)
OLP
20
VHC
245
• Pin and Function Compatible with Other Standard Logic Families
• Latchup Performance Exceeds 300 mA
1
ALYWG
TSSOP−20
DT SUFFIX
CASE 948E
G
• ESD Performance: HBM > 2000 V; Machine Model > 200 V
• Chip Complexity: 308 FETs or 77 Equivalent Gates
• These Devices are Pb−Free and are RoHS Compliant
1
VHC245 = Specific Device Code
A
WL, L
Y
= Assembly Location
= Wafer Lot
= Year
APPLICATION NOTES
WW, W
G or G
= Work Week
= Pb−Free Package
• Do not force a signal on an I/O pin when it is an active output,
damage may occur.
• All floating (high impedance) input or I/O pins must be fixed by
means of pull up or pull down resistors or bus terminator ICs.
(Note: Microdot may be in either location)
• A parasitic diode is formed between the bus and V terminals.
CC
ORDERING INFORMATION
Therefore, the VHC245 cannot be used to interface 5 V to 3 V
systems directly.
†
Device
Package
Shipping
38 Units/Rail
MC74VHC245DWG
MC74VHC245DTG
SOIC−20
TSSOP−20 75 Units/Rail
MC74VHC245DWR2G SOIC−20 1000 Units/Reel
MC74VHC245DTR2G TSSOP−20 2500 Units/T&R
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
May, 2011 − Rev. 6
MC74VHC245/D