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MC-10118BF1-ENY-A PDF预览

MC-10118BF1-ENY-A

更新时间: 2024-11-26 07:16:59
品牌 Logo 应用领域
瑞萨 - RENESAS 微控制器和处理器外围集成电路uCs集成电路uPs集成电路
页数 文件大小 规格书
66页 3664K
描述
MULTIMEDIA PROCESSOR FOR MOBILE APPLICATIONS

MC-10118BF1-ENY-A 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:LFBGA,针数:481
Reach Compliance Code:compliantHTS代码:8542.31.00.01
风险等级:5.84Is Samacsys:N
JESD-30 代码:S-PBGA-B481长度:12.7 mm
端子数量:481最高工作温度:70 °C
最低工作温度:-20 °C封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified座面最大高度:1.3 mm
最大供电电压:1.3 V最小供电电压:1.1 V
标称供电电压:1.2 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:BALL端子节距:0.5 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:12.7 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUIT
Base Number Matches:1

MC-10118BF1-ENY-A 数据手册

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To our customers,  
Old Company Name in Catalogs and Other Documents  
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology  
Corporation, and Renesas Electronics Corporation took over all the business of both  
companies. Therefore, although the old company name remains in this document, it is a valid  
Renesas Electronics document. We appreciate your understanding.  
Renesas Electronics website: http://www.renesas.com  
April 1st, 2010  
Renesas Electronics Corporation  
Issued by: Renesas Electronics Corporation (http://www.renesas.com)  
Send any inquiries to http://www.renesas.com/inquiry.  

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