MBR3100
Preferred Device
Axial Lead Rectifier
This device employs the Schottky Barrier principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlap
contact. Ideally suited for use as rectifiers in low−voltage,
high−frequency inverters, free wheeling diodes, and polarity
protection diodes.
http://onsemi.com
Features
SCHOTTKY BARRIER
RECTIFIER
• Low Reverse Current
• Low Stored Charge, Majority Carrier Conduction
• Low Power Loss/High Efficiency
• Highly Stable Oxide Passivated Junction
• Guard−ring for Stress Protection
• Low Forward Voltage
3.0 AMPERES, 100 VOLTS
• 175°C Operating Junction Temperature
• High Surge Capacity
AXIAL LEAD
CASE 267−05
(DO−201AD)
STYLE 1
• Pb−Free Packages are Available*
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 1.1 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
MARKING DIAGRAM
• Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Polarity: Cathode indicated by Polarity Band
A
MBR
3100
YYWWG
G
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
A
= Assembly Location
= Year
= Work Week
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
100
V
RRM
YY
WW
G
V
RWM
V
I
R
= Pb−Free Package
Average Rectified Forward Current T = 100°C
3.0
A
A
A
O
(Note: Microdot may be in either location)
(R
Note 3)
= 28°C/W, Refer to P.C. Board Mounting,
q
JA
ORDERING INFORMATION
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
I
150
FSM
†
Device
Package
Shipping
MBR3100
Axial Lead
500 Units / Bag
Operating and Storage Junction Temperature
Range (Note 1) (Reverse Voltage Applied)
T , T
J
−65 to
+175
°C
stg
MBR3100G
Axial Lead
(Pb−Free)
500 Units / Bag
Voltage Rate of Change (Rated V )
dv/dt
10
V/ns
R
MBR3100RL
Axial Lead
1500/Tape & Reel
1500/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
MBR3100RLG
Axial Lead
(Pb−Free)
1. The heat generated must be less than the thermal conductivity from
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Junction−to−Ambient: dP /dT < 1/R .
q
JA
D
J
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
June, 2006 − Rev. 6
MBR3100/D