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MBD770DWT1 PDF预览

MBD770DWT1

更新时间: 2024-11-25 22:30:03
品牌 Logo 应用领域
安森美 - ONSEMI 二极管
页数 文件大小 规格书
8页 73K
描述
Dual Schottky Barrier Diodes

MBD770DWT1 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:SC-70包装说明:CASE 419B-02, SC-88, SC-70, 6 PIN
针数:6Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.10.00.60
风险等级:5.28配置:SEPARATE, 2 ELEMENTS
最大二极管电容:1 pF二极管元件材料:SILICON
二极管类型:MIXER DIODE最大正向电压 (VF):1 V
频带:VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCYJESD-30 代码:R-PDSO-G6
JESD-609代码:e0湿度敏感等级:1
元件数量:2端子数量:6
最高工作温度:125 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):240最大功率耗散:0.12 W
认证状态:Not Qualified最大重复峰值反向电压:70 V
子类别:Rectifier Diodes表面贴装:YES
技术:SCHOTTKY端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:30Base Number Matches:1

MBD770DWT1 数据手册

 浏览型号MBD770DWT1的Datasheet PDF文件第2页浏览型号MBD770DWT1的Datasheet PDF文件第3页浏览型号MBD770DWT1的Datasheet PDF文件第4页浏览型号MBD770DWT1的Datasheet PDF文件第5页浏览型号MBD770DWT1的Datasheet PDF文件第6页浏览型号MBD770DWT1的Datasheet PDF文件第7页 
ON Semiconductort  
MBD110DWT1  
MBD330DWT1  
MBD770DWT1  
Dual Schottky Barrier Diodes  
Application circuit designs are moving toward the consolidation of  
device count and into smaller packages. The new SOT–363 package is  
a solution which simplifies circuit design, reduces device count, and  
reduces board space by putting two discrete devices in one small  
six–leaded package. The SOT–363 is ideal for low–power surface  
mount applications where board space is at a premium, such as  
portable products.  
ON Semiconductor Preferred Devices  
6
5
4
Surface Mount Comparisons:  
1
2
3
SOT–363  
SOT–23  
CASE 419B–01, STYLE 6  
SOT–363  
2
Area (mm )  
4.6  
120  
2
7.6  
225  
1
Max Package P (mW)  
Device Count  
D
Space Savings:  
Package  
Anode 1  
N/C 2  
6 Cathode  
1 SOT–23  
2 SOT–23  
SOT–363  
40%  
70%  
5 N/C  
Cathode 3  
4 Anode  
The MBD110DW, MBD330DW, and MBD770DW devices are  
spin–offs of our popular MMBD101LT1, MMBD301LT1, and  
MMBD701LT1 SOT–23 devices. They are designed for  
high–efficiency UHF and VHF detector applications. Readily  
available to many other fast switching RF and digital applications.  
Extremely Low Minority Carrier Lifetime  
Very Low Capacitance  
Low Reverse Leakage  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
Reverse Voltage  
MBD110DWT1  
MBD330DWT1  
MBD770DWT1  
V
R
7.0  
30  
70  
Vdc  
Forward Power Dissipation  
P
T
120  
mW  
F
T
A
= 25°C  
Junction Temperature  
–55 to +125  
–55 to +150  
°C  
°C  
J
Storage Temperature Range  
T
stg  
DEVICE MARKING  
MBD110DWT1 = M4  
MBD330DWT1 = T4  
MBD770DWT1 = H5  
Thermal Clad is a trademark of the Bergquist Company.  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
November, 2001 – Rev.3  
MBD110DWT1/D  

MBD770DWT1 替代型号

型号 品牌 替代类型 描述 数据表
MBD770DWT1G ONSEMI

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