Material Content Data Sheet
Sales Product Name IDV08E65D2
Issued
29. August 2013
2175.58 mg
MA#
MA000997630
Package
PG-TO220-2-22
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
0.330
1.053
0.02
0.05
0.01
48.33
0.06
0.10
9.63
41.49
0.25
0.05
0.00
0.00
0.00
0.01
0.02
152
484
152
leadframe
iron
phosphorus
copper
0.316
145
1051.163
1.283
48.39
0.06
483165
590
483794
590
wire
aluminium
carbon black
epoxy resin
silicondioxide
tin
encapsulation
2.229
1025
96303
414924
2512
512
209.516
902.702
5.465
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
51.22
0.25
512252
2512
leadfinish
plating
nickel
1.114
phosphorus
antimony
silver
0.003
0.05
1
513
solder
0.041
19
0.101
47
non noble metal
< 10%
tin
0.263
0.01
121
187
*deviation
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com