Material Content Data Sheet
Sales Product Name IPB180P04P4L-02
Issued
29. August 2013
1525.33 mg
MA#
MA000762926
PG-TO263-7-3
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
6.489
0.803
0.43
0.05
0.02
52.54
0.86
0.57
6.27
31.15
0.81
0.02
0.00
0.01
0.01
0.29
0.00
0.01
6.96
0.43
4254
526
4254
leadframe
iron
phosphorus
copper
0.241
158
801.714
13.067
8.692
52.61
0.86
525601
8566
5698
62682
311509
8075
177
526285
8566
wire
aluminium
carbon black
epoxy resin
silicondioxide
tin
encapsulation
95.610
475.155
12.317
0.269
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
37.99
0.81
379889
8075
leadfinish
plating
nickel
phosphorus
silver
0.001
0.02
0.31
6.97
0
177
solder
0.116
76
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
tin
0.092
61
lead
4.416
2895
21
3032
heatspreader
*deviation
phosphorus
iron
0.032
0.106
70
copper
106.210
69631
69722
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com