Material Content Data Sheet
Sales Product Name IPB80N04S3-06
Issued
29. August 2013
1558.49 mg
MA#
MA000363514
PG-TO263-3-2
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
3.047
0.304
0.20
0.02
0.01
19.51
0.37
0.66
7.24
36.00
0.62
0.01
0.00
0.00
0.00
0.17
0.01
0.04
35.14
0.20
1955
195
1955
leadframe
iron
phosphorus
copper
0.091
59
304.026
5.808
19.54
0.37
195077
3727
6585
72439
359998
6196
147
195331
3727
wire
aluminium
carbon black
epoxy resin
silicondioxide
tin
encapsulation
10.263
112.895
561.055
9.657
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
43.90
0.62
439023
6196
leadfinish
plating
nickel
0.228
phosphorus
silver
0.001
0.01
0.17
1
147
solder
0.068
44
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
tin
0.055
35
lead
2.612
1676
106
1755
heatspreader
*deviation
phosphorus
iron
0.165
0.548
352
copper
547.666
35.19
351408
351866
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com