Material Content Data Sheet
Sales Product Name IPB049NE7N3 G
Issued
29. August 2013
1559.47 mg
MA#
MA000926354
PG-TO263-3-2
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
4.423
0.304
0.28
0.02
0.01
19.50
0.47
0.66
7.21
35.83
0.62
0.01
0.00
0.01
0.00
0.21
0.01
0.04
35.12
0.28
2836
195
2836
leadframe
iron
phosphorus
copper
0.091
59
304.026
7.375
19.53
0.47
194955
4729
6556
72113
358378
6192
146
195209
4729
wire
aluminium
carbon black
epoxy resin
silicondioxide
tin
encapsulation
10.223
112.457
558.879
9.657
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
43.70
0.62
437047
6192
leadfinish
plating
nickel
0.228
phosphorus
silver
0.001
0.01
0.22
0
146
solder
0.086
55
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
tin
0.069
44
lead
3.271
2098
105
2197
heatspreader
*deviation
phosphorus
iron
0.165
0.548
352
copper
547.666
35.17
351187
351644
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com