Material Content Data Sheet
Sales Product Name IPD50N03S2L-06
Issued
29. August 2013
371.55 mg
MA#
MA000254532
Package
PG-TO252-3-11
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
4.029
0.234
0.070
234.187
1.922
1.241
21.713
101.122
3.740
0.091
0.000
0.080
0.064
3.055
1.08
0.06
0.02
63.04
0.52
0.33
5.84
27.22
1.01
0.02
0.00
0.02
0.02
0.82
1.08
10843
631
10843
leadframe
iron
phosphorus
copper
189
63.12
0.52
630300
5173
3339
58440
272166
10066
244
631120
5173
wire
aluminium
carbon black
epoxy resin
silicondioxide
tin
encapsulation
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
33.39
1.01
333945
10066
leadfinish
plating
nickel
phosphorus
silver
0.02
1
245
solder
215
non noble metal
non noble metal
< 10%
tin
172
lead
0.86
8221
8608
*deviation
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com