品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | / | |
页数 | 文件大小 | 规格书 |
81页 | 497K | |
描述 | ||
64 Mbit (4Mb x 16, Multiple Bank, Burst ) 1.8V Supply Flash Memory |
是否Rohs认证: | 不符合 | 生命周期: | Transferred |
零件包装代码: | BGA | 包装说明: | 7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56 |
针数: | 56 | Reach Compliance Code: | not_compliant |
ECCN代码: | 3A991.B.1.A | HTS代码: | 8542.32.00.51 |
风险等级: | 5.21 | 最长访问时间: | 70 ns |
启动块: | TOP | 命令用户界面: | YES |
通用闪存接口: | YES | 数据轮询: | NO |
JESD-30 代码: | R-PBGA-B56 | JESD-609代码: | e0 |
长度: | 9 mm | 内存密度: | 67108864 bit |
内存集成电路类型: | FLASH | 内存宽度: | 16 |
功能数量: | 1 | 部门数/规模: | 8,127 |
端子数量: | 56 | 字数: | 4194304 words |
字数代码: | 4000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 4MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装等效代码: | BGA56,7X8,30 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
页面大小: | 4 words | 并行/串行: | PARALLEL |
电源: | 1.8/2,1.8/3 V | 编程电压: | 1.8 V |
认证状态: | Not Qualified | 座面最大高度: | 1 mm |
部门规模: | 4K,32K | 最大待机电流: | 0.000005 A |
子类别: | Flash Memories | 最大压摆率: | 0.03 mA |
最大供电电压 (Vsup): | 2.2 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Lead (Sn63Pb37) | 端子形式: | BALL |
端子节距: | 0.75 mm | 端子位置: | BOTTOM |
切换位: | NO | 类型: | NOR TYPE |
宽度: | 7.7 mm | Base Number Matches: | 1 |
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