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M58WR064T85ZB6T PDF预览

M58WR064T85ZB6T

更新时间: 2024-11-13 04:18:15
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 闪存存储内存集成电路
页数 文件大小 规格书
81页 497K
描述
64 Mbit (4Mb x 16, Multiple Bank, Burst ) 1.8V Supply Flash Memory

M58WR064T85ZB6T 技术参数

是否Rohs认证:不符合生命周期:Transferred
零件包装代码:BGA包装说明:7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56
针数:56Reach Compliance Code:not_compliant
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.23Is Samacsys:N
最长访问时间:85 ns启动块:TOP
命令用户界面:YES通用闪存接口:YES
数据轮询:NOJESD-30 代码:R-PBGA-B56
JESD-609代码:e0长度:9 mm
内存密度:67108864 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
部门数/规模:8,127端子数量:56
字数:4194304 words字数代码:4000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:4MX16
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装等效代码:BGA56,7X8,30封装形状:RECTANGULAR
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH页面大小:4 words
并行/串行:PARALLEL电源:1.8/2,1.8/3 V
编程电压:1.8 V认证状态:Not Qualified
座面最大高度:1 mm部门规模:4K,32K
最大待机电流:0.000005 A子类别:Flash Memories
最大压摆率:0.03 mA最大供电电压 (Vsup):2.2 V
最小供电电压 (Vsup):1.65 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn63Pb37)
端子形式:BALL端子节距:0.75 mm
端子位置:BOTTOM切换位:NO
类型:NOR TYPE宽度:7.7 mm
Base Number Matches:1

M58WR064T85ZB6T 数据手册

 浏览型号M58WR064T85ZB6T的Datasheet PDF文件第2页浏览型号M58WR064T85ZB6T的Datasheet PDF文件第3页浏览型号M58WR064T85ZB6T的Datasheet PDF文件第4页浏览型号M58WR064T85ZB6T的Datasheet PDF文件第5页浏览型号M58WR064T85ZB6T的Datasheet PDF文件第6页浏览型号M58WR064T85ZB6T的Datasheet PDF文件第7页 
M58WR064T  
M58WR064B  
64 Mbit (4Mb x 16, Multiple Bank, Burst )  
1.8V Supply Flash Memory  
PRODUCT PREVIEW  
FEATURES SUMMARY  
SUPPLY VOLTAGE  
Figure 1. Packages  
– V = 1.65V to 2.2V for Program, Erase and  
DD  
Read  
– V  
= 1.65V to 3.3V for I/O Buffers  
DDQ  
– V = 12V for fast Program (optional)  
PP  
SYNCHRONOUS / ASYNCHRONOUS READ  
– Synchronous Burst Read mode : 52MHz  
FBGA  
– Asynchronous/ Synchronous Page Read  
mode  
– Random Access: 70, 85, 100 ns  
PROGRAMMING TIME  
– 8µs by Word typical for Fast Factory Program  
– Double/Quadruple Word Program option  
– Enhanced Factory Program options  
MEMORY BLOCKS  
VFBGA56 (ZB)  
7.7 x 9 mm  
– Multiple Bank Memory Array: 4 Mbit Banks  
– Parameter Blocks (Top or Bottom location)  
DUAL OPERATIONS  
ELECTRONIC SIGNATURE  
– Manufacturer Code: 20h  
– Program Erase in one Bank while Read in  
others  
– Top Device Code, M58WR064T: 8810h  
– Bottom Device Code, M58WR064B: 8811h  
– No delay between Read and Write operations  
BLOCK LOCKING  
– All blocks locked at Power up  
– Any combination of blocks can be locked  
– WP for Block Lock-Down  
SECURITY  
– 128 bit user programmable OTP cells  
– 64 bit unique device number  
– One parameter block permanently lockable  
COMMON FLASH INTERFACE (CFI)  
100,000 PROGRAM/ERASE CYCLES per  
BLOCK  
April 2002  
1/81  
This is preliminary information on a new product now in development. Details are subject to change without notice.  

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