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M29DW323DB PDF预览

M29DW323DB

更新时间: 2024-10-25 22:36:07
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
49页 766K
描述
32 Mbit 4Mb x8 or 2Mb x16, Dual Bank 8:24, Boot Block 3V Supply Flash Memory

M29DW323DB 数据手册

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M29DW323DT  
M29DW323DB  
32 Mbit (4Mb x8 or 2Mb x16, Dual Bank 8:24, Boot Block)  
3V Supply Flash Memory  
FEATURES SUMMARY  
SUPPLY VOLTAGE  
Figure 1. Packages  
– V = 2.7V to 3.6V for Program, Erase and  
CC  
Read  
– V =12V for Fast Program (optional)  
PP  
ACCESS TIME: 70, 90ns  
PROGRAMMING TIME  
– 10µs per Byte/Word typical  
TSOP48 (N)  
12 x 20mm  
– Double Word/ Quadruple Byte Program  
MEMORY BLOCKS  
– Dual Bank Memory Array: 8Mbit+24Mbit  
– Parameter Blocks (Top or Bottom Location)  
DUAL OPERATIONS  
FBGA  
– Read in one bank while Program or Erase in  
other  
TFBGA63 (ZA)  
7 x 11mm  
ERASE SUSPEND and RESUME MODES  
– Read and Program another Block during  
Erase Suspend  
UNLOCK BYPASS PROGRAM COMMAND  
– Faster Production/Batch Programming  
FBGA  
V /WP PIN for FAST PROGRAM and WRITE  
PP  
PROTECT  
TEMPORARY BLOCK UNPROTECTION  
TFBGA48 (ZE)  
6 x 8mm  
MODE  
COMMON FLASH INTERFACE  
– 64 bit Security Code  
EXTENDED MEMORY BLOCK  
– Extra block used as security block or to store  
additional information  
LOW POWER CONSUMPTION  
– Standby and Automatic Standby  
100,000 PROGRAM/ERASE CYCLES per  
BLOCK  
ELECTRONIC SIGNATURE  
– Manufacturer Code: 0020h  
– Top Device Code M29DW323DT: 225Eh  
– Bottom Device Code M29DW323DB: 225Fh  
June 2003  
1/49  

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