生命周期: | Obsolete | 包装说明: | 8 X 11 MM, PLASTIC, CSP-72 |
Reach Compliance Code: | unknown | 风险等级: | 5.83 |
Is Samacsys: | N | 其他特性: | ALSO CONTAINS 4 MBIT SRAM |
JESD-30 代码: | R-PBGA-B72 | 长度: | 11 mm |
内存密度: | 16777216 bit | 内存集成电路类型: | MEMORY CIRCUIT |
内存宽度: | 16 | 功能数量: | 1 |
端子数量: | 72 | 字数: | 1048576 words |
字数代码: | 1000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -25 °C |
组织: | 1MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH | 认证状态: | Not Qualified |
座面最大高度: | 1.4 mm | 最大供电电压 (Vsup): | 3.3 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
宽度: | 8 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
LRS1336 | SHARP |
获取价格 |
Memory Circuit, Flash+SRAM, Hybrid, PBGA64, | |
LRS1337 | SHARP |
获取价格 |
Stacked Chip 32M Flash Memory and 4M SRAM | |
LRS1338A | SHARP |
获取价格 |
Stacked Chip 8M Flash Memory and 2M SRAM | |
LRS1341 | SHARP |
获取价格 |
Stacked Chip 16M Flash Memory and 2M SRAM | |
LRS1342 | SHARP |
获取价格 |
Stacked Chip 16M Flash Memory and 2M SRAM | |
LRS1348 | ETC |
获取价格 |
Flash ROM | |
LRS1349 | SHARP |
获取价格 |
Memory Circuit, Flash+SRAM, Hybrid, PBGA72, | |
LRS1360 | ETC |
获取价格 |
Flash ROM | |
LRS1360C | ETC |
获取价格 |
MIXED MEMORY|SRAM+EEPROM|HYBRID|BGA|72PIN|PLASTIC | |
LRS1361F | ETC |
获取价格 |
MIXED MEMORY|SRAM+EEPROM|HYBRID|BGA|72PIN|PLASTIC |