生命周期: | Obsolete | 包装说明: | 8 X 11 MM, STACK, FBGA-72 |
Reach Compliance Code: | unknown | 风险等级: | 5.84 |
最长访问时间: | 120 ns | 其他特性: | CONFIGURABLE AS 512K X 16 |
JESD-30 代码: | R-PBGA-B72 | 长度: | 11 mm |
内存密度: | 8388608 bit | 内存集成电路类型: | FLASH |
内存宽度: | 8 | 功能数量: | 1 |
端子数量: | 72 | 字数: | 1048576 words |
字数代码: | 1000000 | 组织: | 1MX8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH |
编程电压: | 3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.4 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 2.7 V | 表面贴装: | YES |
技术: | CMOS | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
类型: | NOR TYPE | 宽度: | 8 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
LRS1319 | SHARP |
获取价格 |
Memory Circuit, 512KX16, CMOS, PDSO48, 10 X 14 MM, 0.40 MM PITCH, PLASTIC, TSOP-48 | |
LRS1320A | ETC |
获取价格 |
SRAM/EEPROM | |
LRS1322 | SHARP |
获取价格 |
Memory Circuit, 16MX16, CMOS, PBGA72, 8 X 11 MM, PLASTIC, CSP-72 | |
LRS1327 | SHARP |
获取价格 |
Memory Circuit, 512KX16, CMOS, PBGA64, 8 X 8 MM, PLASTIC, CSP-64 | |
LRS1329 | SHARP |
获取价格 |
Stacked Chip 16M Flash and 2M SRAM | |
LRS1329A | ETC |
获取价格 |
MIXED MEMORY|SRAM+EEPROM|HYBRID|BGA|72PIN|PLASTIC | |
LRS1331 | SHARP |
获取价格 |
Stacked Chip 16M Flash Memory and 4M SRAM | |
LRS1331B | SHARP |
获取价格 |
暂无描述 | |
LRS1331C | SHARP |
获取价格 |
Memory Circuit, 1MX16, CMOS, PBGA72, 8 X 11 MM, PLASTIC, CSP-72 | |
LRS1336 | SHARP |
获取价格 |
Memory Circuit, Flash+SRAM, Hybrid, PBGA64, |