Lead-free Green
LMN200B02
200 mA LOAD SWITCH FEATURING PRE-BIASED PNP TRANSISTOR AND N-MOSFET
WITH GATE PULL DOWN RESISTOR
General Description
·
LMN200B02 is best suited for applications where the load
needs to be turned on and off using control circuits like
micro-controllers, comparators etc. particularly at a point
of load. It features a discrete pass transistor with stable
VCE(SAT) which does not depend on the input voltage and
can support continuous maximum current of 200 mA . It
also contains a discrete N-MOSFET that can be used as
control. This N-MOSFET also has a built-in pull down
resistor at its gate. The component can be used as a part
of a circuit or as a stand alone discrete device.
6
5
4
1
2
3
Features
Fig. 1: SOT-363
·
·
·
·
·
·
Voltage Controlled Small Signal Switch
N-MOSFET with Gate Pull-Down Resistor
Surface Mount Package
B_Q1
5
C_Q1
6
S_Q2
4
Ideally Suited for Automated Assembly Processes
Lead Free By Design/ROHS Compliant (Note 1)
"Green" Device (Note 2)
C
DDTB142JU_DIE
Q1
Mechanical Data
B
R2
R3
37K
G
PNP
470
S
·
·
Case: SOT-363
E
R1
Q2
NMOS
10K
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
DSNM6047_DIE
D
·
·
·
Moisture sensitivity: Level 1 per J-STD-020C
Terminal Connections: See Diagram
3
2
1
Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
G_Q2
E_Q1
D_Q2
·
·
·
Marking & Type Code Information: See Last Page
Ordering Information: See Last Page
Fig. 2 Schematic and Pin Configuration
Weight: 0.016 grams (approximate)
Refere
Sub-Component P/N
nce
R3
Device Type
PNP Transistor
N-MOSFET
R1 (NOM)
R2 (NOM)
Figure
(NOM)
DDTB142JU_DIE
Q1
Q2
10K
470
¾
2
2
DSNM6047_DIE (with Gate
Pull-Down Resistor)
¾
¾
37K
@ T = 25°C unless otherwise specified
Maximum Ratings, Total Device
A
Characteristic
Power Dissipation (Note 3)
Power Derating Factor above 125°C
Output Current
Symbol
Pd
Value
200
Unit
mW
Pder
1.6
mW/°C
mA
Iout
200
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Tj,Tstg
Junction Operation and Storage Temperature Range
-55 to +150
°C
Thermal Resistance, Junction to Ambient Air (Equivalent to
One Heated Junction of PNP Transistor)
RqJA
625
°C/W
Notes:
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
DS30658 Rev. 4 - 2
1 of 10
LMN200B02
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ã Diodes Incorporated