是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | TFBGA, BGA49,7X7,20 | 针数: | 49 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 26 weeks |
风险等级: | 5.59 | 总线兼容性: | I2C |
JESD-30 代码: | S-PBGA-B49 | JESD-609代码: | e1 |
长度: | 4 mm | 湿度敏感等级: | 1 |
I/O 线路数量: | 4 | 端口数量: | 4 |
端子数量: | 49 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装等效代码: | BGA49,7X7,20 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 2.5 V |
认证状态: | Not Qualified | 座面最大高度: | 1.1 mm |
子类别: | Other Microprocessor ICs | 最大压摆率: | 80 mA |
最大供电电压: | 2.9 V | 最小供电电压: | 2.25 V |
标称供电电压: | 2.75 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 4 mm |
uPs/uCs/外围集成电路类型: | PARALLEL IO PORT, GENERAL PURPOSE | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
LM8333GGR8X | NSC |
获取价格 |
IC SPECIALTY MICROPROCESSOR CIRCUIT, PBGA49, MICRO ARRAY-49, Microprocessor IC:Other | |
LM8333GGR8X/NOPB | TI |
获取价格 |
Mobile I/O Companion Supporting Key-Scan, I/O Expansion, PWM, and ACCESS.bus Host Interfac | |
LM8335 | TI |
获取价格 |
LM8335 General Purpose Output Expander with M | |
LM8335TLE | TI |
获取价格 |
LM8335 General Purpose Output Expander with M | |
LM8335TLE/NOPB | TI |
获取价格 |
LM8335 General Purpose Output Expander with M | |
LM8335TLENOPB | TI |
获取价格 |
LM8335 General Purpose Output Expander with M | |
LM8335TLX | TI |
获取价格 |
LM8335 General Purpose Output Expander with M | |
LM8335TLX/NOPB | TI |
获取价格 |
LM8335 General Purpose Output Expander with M | |
LM833AN | TI |
获取价格 |
IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,PLASTIC | |
LM833AN/A+ | TI |
获取价格 |
IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,PLASTIC |