Datasheet > LM8335

LM8335

更新时间： 2024-11-24 12:09:51

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德州仪器 - TI		/
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LM8335 General Purpose Output Expander with MIPIÂ® RFFE Host Interface

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LM8335 数据手册

LM8335

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SNVS840 –JUNE 2012

LM8335 General Purpose Output Expander with MIPI® RFFE Host Interface

Check for Samples: LM8335

FEATURES

•

MIPI RFFE Interface Version 1.10 Compliant

KEY SPECIFICATIONS

Supports Output Expansion

•

1.8 ± 0.15V MIPI RFFE Operation (VIO)

1.8 ± 0.15V Core Supply (V_DD

1.65 to 3.6V GPO Supply (V_DDIO

Host Interface Address Select Pin:

)

–

ADR=GND, USID[3:0]=0001

ADR=VDD, USID[3:0]=1001

)

Low Standby and Active Current

On-Chip Power-On Reset (POR)

−30 to +85°C Ambient Temperature Range

16-Bump DSBGA Package

•

Pin-Configurable Initial State: VIO

–

CFG=GND, GPO High-z, with Weak Internal

Pull-Down Resistor Enabled;

GPO_OUT_DATA is Unmasked

–

1.965 mm x 1.965 mm x 0.6 mm, 0.5 mm

Pitch (Nominal)

–

CFG=VDD, GPO High-z, with Weak Internal

Pull-Down Resistor Enabled;

GPO_OUT_DATA is Masked

DESCRIPTION

Three Sources for Chip Reset:

The LM8335 General Purpose Output Expander is a

dedicated device to provide flexible and general

purpose, host programmable output expansion

functions. This device communicates with a host

processor through a MIPI® RFFE Interface (Mobile

Industry Processor Interface RF Front-End).

–

VIO Input Pin

POR

Software-Commanded Reset

APPLICATIONS:

Eight general purpose outputs (GPO) can be

configured by the host controller as drive

high/low/high-z. Weak pull-ups (PU) or weak pull-

downs (PD) can be enabled.

•

Smart Handheld Devices

RF Transceiver Applications

Upon power-on, the LM8335 default configuration is

for all GPO to be set based on the state of the CFG

pin.

After startup, any changes to the default configuration

must be sent from the host via the MIPI RFFE host

interface..

The LM8335 is available in a 16-bump lead-free

DSBGA package of size 1.965 mm x 1.965 mm x 0.6

mm (0.5 mm pitch).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

PRODUCT PREVIEW information concerns products in the

formative or design phase of development. Characteristic data and

other specifications are design goals. Texas Instruments reserves

the right to change or discontinue these products without notice.

12 3 4 5 6 7...16

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