LM3263
www.ti.com
SNVS837 –JUNE 2013
LM3263 High-Current Step-Down DC-DC Converter with MIPI® RF Front-End
Control Interface for RF Power Amplifiers
Check for Samples: LM3263
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FEATURES
DESCRIPTION
The LM3263 is a DC-DC converter optimized for
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MIPI® RFFE Digital Control Interface
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powering multi-mode multi-band RF power amplifiers
(PAs) from a single Lithium-Ion cell. The LM3263
steps down an input voltage from 2.7V to 5.5V to a
dynamically adjustable output voltage of 0.4V to 3.6V.
The output voltage is externally programmed through
the RFFE Digital Control Interface and is set to
ensure efficient operation at all power levels of the
RF PA.
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High-Efficiency PFM and PWM Modes with
Internal Seamless Transition
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Operates from a Single Li-Ion Cell: 2.7V to 5.5V
Dynamically Adjustable Output Voltage: 0.4V
to 3.6V (typ.) in PFM and PWM Modes
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2.5A Maximum Load Current in PWM Mode
2.7 MHz (typ.) Switching Frequency
ACB (reduces inductor requirements and size)
Internal Compensation
The LM3263 operates in modulated frequency PWM
mode producing a small and predictable amount of
output voltage ripple. PWM mode enables best
meeting power requirements and stringent spectral
compliance, with the minimal amount of filtering and
excess headroom. When operating in PFM mode, the
LM3263 enables the lowest current consumption
across PA output power level settings and therefore
maximizes system efficiency.
Current and Thermal Overload Protection
16-bump DSBGA Package
Very small Solution Size: approx. 9.8 mm2
APPLICATIONS
The LM3263 has a unique Active Current assist and
analog Bypass (ACB) feature to minimize inductor
size without any loss of output regulation for the
entire battery voltage and RF output power range,
until dropout. ACB provides a parallel current path,
when needed, to limit the maximum inductor current
to 1.45A (typ) while still driving a 2.5A load. The
analog bypass feature also enables operation with
minimal dropout voltage.
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Smartphones
RF PC Cards
Tablets, eBook Readers
Handheld Radios
Battery-Powered RF Devices
The LM3263 is available in a small 2 mm x 2 mm
chip-scale 16-bump DSBGA package.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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MIPI is a registered trademark of Mobile Industry Processor Interface Alliance.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated