是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 包装说明: | VFBGA, |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 5.73 | 其他特性: | ALSO OPERATES IN PFM CONTROL TECHNIQUE; ADJUSTABLE OUTPUT MODE FROM 0.4 TO 4.212V |
模拟集成电路 - 其他类型: | SWITCHING REGULATOR | 控制技术: | PULSE WIDTH MODULATION |
最大输入电压: | 5.5 V | 最小输入电压: | 2.7 V |
标称输入电压: | 3.8 V | JESD-30 代码: | R-PBGA-B16 |
JESD-609代码: | e1 | 长度: | 2.499 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 16 | 最高工作温度: | 85 °C |
最低工作温度: | -30 °C | 最大输出电流: | 1 A |
最大输出电压: | 4.2 V | 最小输出电压: | 0.4 V |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 座面最大高度: | 0.675 mm |
表面贴装: | YES | 切换器配置: | BUCK-BOOST |
最大切换频率: | 2700 kHz | 温度等级: | OTHER |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 2.116 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
LM3279TLE/NOPB | TI |
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具有用于 3G 和 4G 射频功率放大器的 MIPI® RFFE 接口的降压-升压转换器 |
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