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LM3279TLE/NOPB PDF预览

LM3279TLE/NOPB

更新时间: 2024-11-13 11:08:07
品牌 Logo 应用领域
德州仪器 - TI 升压转换器开关放大器控制器开关式稳压器开关式控制器射频功率放大器输出元件电源电路开关式稳压器或控制器
页数 文件大小 规格书
31页 1616K
描述
具有用于 3G 和 4G 射频功率放大器的 MIPI® RFFE 接口的降压-升压转换器 | YZR | 16 | -30 to 85

LM3279TLE/NOPB 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:VFBGA,
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:6 weeks
风险等级:1.72其他特性:ALSO OPERATES IN PFM CONTROL TECHNIQUE; ADJUSTABLE OUTPUT MODE FROM 0.4 TO 4.212V
模拟集成电路 - 其他类型:SWITCHING REGULATOR控制技术:PULSE WIDTH MODULATION
最大输入电压:5.5 V最小输入电压:2.7 V
标称输入电压:3.8 VJESD-30 代码:R-PBGA-B16
JESD-609代码:e1长度:2.499 mm
湿度敏感等级:1功能数量:1
端子数量:16最高工作温度:85 °C
最低工作温度:-30 °C最大输出电流:1 A
最大输出电压:4.2 V最小输出电压:0.4 V
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):260座面最大高度:0.675 mm
表面贴装:YES切换器配置:BUCK-BOOST
最大切换频率:2700 kHz温度等级:OTHER
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.5 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:2.116 mm
Base Number Matches:1

LM3279TLE/NOPB 数据手册

 浏览型号LM3279TLE/NOPB的Datasheet PDF文件第2页浏览型号LM3279TLE/NOPB的Datasheet PDF文件第3页浏览型号LM3279TLE/NOPB的Datasheet PDF文件第4页浏览型号LM3279TLE/NOPB的Datasheet PDF文件第5页浏览型号LM3279TLE/NOPB的Datasheet PDF文件第6页浏览型号LM3279TLE/NOPB的Datasheet PDF文件第7页 
LM3279  
www.ti.com  
SNVS970A MARCH 2013REVISED MAY 2013  
LM3279 Buck-Boost Converter with MIPI® RFFE Interface  
for 3G and 4G RF Power Amplifiers  
Check for Samples: LM3279  
1
FEATURES  
DESCRIPTION  
The LM3279 is a buck-boost DC/DC converter  
2
MIPI® RFFE Digital Control Interface  
designed to generate output voltages above or below  
a given input voltage and is particularly suitable for  
Power Amplifiers operating from single-cell Li-Ion  
batteries in portable applications.  
High-Efficiency PFM and PWM Modes with  
Internal Seamless Transition  
Operates from a Single Li-Ion Cell: 2.7V to 5.5V  
Adjustable Output Voltage:  
The LM3279 has four modes of operation: Pulse  
Width Modulation (PWM), Pulse Frequency  
Modulation (PFM), standby, and shutdown. During  
normal conditions, the LM3279 operates in full  
synchronous PWM mode at 2.4 MHz typical switching  
frequency, providing seamless transitions between  
buck and boost operating regimes. Energy-saving  
PFM mode increases efficiencies and current savings  
during low-power RF transmission modes. For high-  
transmit power, the device operates in PWM buck or  
boost mode, whereas the device can transition  
between PWM and PFM modes during low-power  
transmit. The LM3279 can be controlled either via an  
included MIPI® RFFE Digital Control Interface or by  
using an analog control from an external MCU,  
offering design flexibility.  
RFFE Digital Control: 0.4V to 4.2V  
Analog Control: 0.6V to 4.2V  
1A Maximum Load Capability for VBATT 3.2V,  
VOUT = 3.6V  
2.4 MHz (typ.) Switching Frequency  
Seamless Buck-Boost Mode Transition  
Fast Output Voltage Transition: 0.8V to 4.0V in  
20 µs  
High-Efficiency: 95% typ. at VBATT = 3.7V,  
VOUT = 3.3V, at 300 mA  
Input Over-Current Limit  
Output Over-Voltage Clamp  
Internal Compensation  
The power converter topology enables minimum total  
solution size by using one small footprint and case  
size inductor and two surface mount capacitors.  
16-bump DSBGA Package  
APPLICATIONS  
The LM3279 is internally compensated for buck and  
boost modes of operation thus providing an optimal  
transient response.  
3G/4G Smartphones  
RF PC Cards  
The LM3279 is available in a small 16-bump lead-free  
DSBGA package of size 2.121 mm x 2.504 mm.  
Tablets, eBooks Readers  
Battery-Powered RF Devices  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2013, Texas Instruments Incorporated  

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