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LM3279

更新时间: 2024-11-12 12:30:23
品牌 Logo 应用领域
德州仪器 - TI 转换器放大器射频功率放大器
页数 文件大小 规格书
31页 1616K
描述
LM3279 Buck-Boost Converter with MIPI RFFE Interfacefor 3G and 4G RF Power Amplifiers

LM3279 数据手册

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LM3279  
www.ti.com  
SNVS970A MARCH 2013REVISED MAY 2013  
LM3279 Buck-Boost Converter with MIPI® RFFE Interface  
for 3G and 4G RF Power Amplifiers  
Check for Samples: LM3279  
1
FEATURES  
DESCRIPTION  
The LM3279 is a buck-boost DC/DC converter  
2
MIPI® RFFE Digital Control Interface  
designed to generate output voltages above or below  
a given input voltage and is particularly suitable for  
Power Amplifiers operating from single-cell Li-Ion  
batteries in portable applications.  
High-Efficiency PFM and PWM Modes with  
Internal Seamless Transition  
Operates from a Single Li-Ion Cell: 2.7V to 5.5V  
Adjustable Output Voltage:  
The LM3279 has four modes of operation: Pulse  
Width Modulation (PWM), Pulse Frequency  
Modulation (PFM), standby, and shutdown. During  
normal conditions, the LM3279 operates in full  
synchronous PWM mode at 2.4 MHz typical switching  
frequency, providing seamless transitions between  
buck and boost operating regimes. Energy-saving  
PFM mode increases efficiencies and current savings  
during low-power RF transmission modes. For high-  
transmit power, the device operates in PWM buck or  
boost mode, whereas the device can transition  
between PWM and PFM modes during low-power  
transmit. The LM3279 can be controlled either via an  
included MIPI® RFFE Digital Control Interface or by  
using an analog control from an external MCU,  
offering design flexibility.  
RFFE Digital Control: 0.4V to 4.2V  
Analog Control: 0.6V to 4.2V  
1A Maximum Load Capability for VBATT 3.2V,  
VOUT = 3.6V  
2.4 MHz (typ.) Switching Frequency  
Seamless Buck-Boost Mode Transition  
Fast Output Voltage Transition: 0.8V to 4.0V in  
20 µs  
High-Efficiency: 95% typ. at VBATT = 3.7V,  
VOUT = 3.3V, at 300 mA  
Input Over-Current Limit  
Output Over-Voltage Clamp  
Internal Compensation  
The power converter topology enables minimum total  
solution size by using one small footprint and case  
size inductor and two surface mount capacitors.  
16-bump DSBGA Package  
APPLICATIONS  
The LM3279 is internally compensated for buck and  
boost modes of operation thus providing an optimal  
transient response.  
3G/4G Smartphones  
RF PC Cards  
The LM3279 is available in a small 16-bump lead-free  
DSBGA package of size 2.121 mm x 2.504 mm.  
Tablets, eBooks Readers  
Battery-Powered RF Devices  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2013, Texas Instruments Incorporated  

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