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KM718V947T-80000 PDF预览

KM718V947T-80000

更新时间: 2024-11-15 06:17:35
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器内存集成电路
页数 文件大小 规格书
17页 385K
描述
ZBT SRAM, 512KX18, 8.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100

KM718V947T-80000 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:LQFP,针数:100
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.84
最长访问时间:8.5 ns其他特性:FLOW-THROUGH ARCHITECTURE
JESD-30 代码:R-PQFP-G100长度:20 mm
内存密度:9437184 bit内存集成电路类型:ZBT SRAM
内存宽度:18功能数量:1
端子数量:100字数:524288 words
字数代码:512000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:512KX18封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:1.6 mm
最大供电电压 (Vsup):3.465 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD宽度:14 mm
Base Number Matches:1

KM718V947T-80000 数据手册

 浏览型号KM718V947T-80000的Datasheet PDF文件第2页浏览型号KM718V947T-80000的Datasheet PDF文件第3页浏览型号KM718V947T-80000的Datasheet PDF文件第4页浏览型号KM718V947T-80000的Datasheet PDF文件第5页浏览型号KM718V947T-80000的Datasheet PDF文件第6页浏览型号KM718V947T-80000的Datasheet PDF文件第7页 
KM736V847  
KM718V947  
256Kx36 & 512Kx18 Flow-Through NtRAMTM  
Document Title  
256Kx36 & 512Kx18-Bit Flow Through NtRAMTM  
Revision History  
Rev. No.  
History  
Draft Date  
Remark  
0.0  
0.1  
1. Initial document.  
April. 09. 1998  
June. 02. 1998  
Preliminary  
Preliminary  
Modify from ADV to ADV at timing.  
Add the Trade Mark( NtRAMTM  
)
0.2  
Sep. 09. 1998  
Preliminary  
1. Changed tCD from 8.0ns to 8.5ns at -8  
2. Changed tCYC from 13.0ns to 12.0ns at -10  
3. Changed DC condition at Icc and parameters  
Icc ; from 240mA to 260mA at -10,  
ISB1 ; from 10mA to 30mA,  
ISB2 ; from 10mA to 30mA.  
0.3  
Oct. 15. 1998  
Preliminary  
1. ADD 119BGA(7x17 Ball Grid Array Package) .  
2. ADD x32 organization  
0.4  
0.5  
1.0  
Dec. 10. 1998  
Dec. 23. 1998  
Jan. 29. 1999  
Preliminary  
Preliminary  
Final  
ADD VDDQ Supply voltage( 2.5V )  
Changed VOL Max value from 0.2V to 0.4V at 2.5V I/O.  
1. Final Spec Release.  
2. Remove x32 organization.  
2.0  
3.0  
4.0  
Feb. 25. 1999  
May. 13. 1999  
Nov. 19. 1999  
Final  
Final  
Final  
1. Remove VDDQ Supply voltage( 2.5V I/O )  
1. Add VDDQ Supply voltage( 2.5V I/O )  
1. Add tCYC 117MHz.  
2. Remove 119BGA package.  
3. Change tCYC from 12ns to 10ns at -9.  
4. Changed DC condition at Icc and parameters  
Icc ; from 300mA to 280mA at -8,  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the  
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-  
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.  
- 1 -  
November 1999  
Rev 4.0  

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